TGV Through-Glass-Via Coating Production Line
Equipment description: The TS-CJLX TGV glass-through-via coating line is designed for semiconductor glass substrates, PCBs and other electronic components. PVD, such as sputtering, or CVD deposits a thin metal seed layer, usually copper or titanium, on glass surfaces and via walls to provide a conductive base for subsequent plating and metal filling. Features: TGV processing sequentially deposits insulating layers such as SiO2/Al2O3 and conductive layers. Conventional repeated target changes and pumpdowns are inefficient and risk contamination. Tengsheng Technology's integrated multichamber PVD/CVD system continuously deposits insulating/conductive layers, increasing capacity by over 30%. Glass provides excellent electrical properties and mechanical stability for packaging, high-frequency applications, optical inspection and optical-path integration. Fan-out packaging.
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