Hole-surface copper thickness inspection (BM-QK01)
Mainly used for surface copper thickness and hole copper thickness inspection of PCB copper-clad laminates; usually arranged after the electroplating line to determine the quality of electroplating and the stability of electroplated copper thickness, and to adjust actual electroplating parameters based on inspection data.; ● Adopts imported well-known brand hole copper inspection instruments, with reliable accuracy and stability;; ● In-line equipment, connected to the electroplating line, to achieve full inspection of every board;; ● The equipment is equipped with an independently developed QR code recognition system, which can accurately read the QR code on the board surface and achieve data binding;; ● Floating mechanism design for the hole copper probe to avoid accidental damage;; ● Independently developed software, meeting personalized and customized needs, supporting MES system integration.; Copper-clad laminate hole-surface copper thickness inspection
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Overview
Specifications
| Parameter | Value |
|---|---|
| Hole copper detection range | 5~80 um |
| Hole copper detection accuracy | ±5 % |
| Surface copper detection range | 0.25~200 um |
| Surface copper detection accuracy | ±5 % |
| PCB size | 18“×16”~28“×24.5” |
| Production efficiency | 5 pcs/min (28.5" x24", thickness 1 mm or above) |
| Loading/unloading method | In-line |
| Positioning method | Mechanical centering + CCD vision positioning |
Datasheet
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