Laser glass cutting

Maximum operating power: 6000 W Wavelength band: 1060 nm-1080nm Fiber optic interface: QBH

Machinable size: 1400*2650 Processing thickness: 1.6~4.0 mm Feeding method: Compatible with long and short edge feeding

Chamfering of hole edges after laser drilling, reducing microcracks and improving glass strength. CCD vision positioning, fully automated chamfering, supports different thicknesses and hole diameters.

Processable incoming material size: 650 mm × 550 mm Laser: 1064 mm&10.6 um Cutting dimensional accuracy: ±0.02 mm

Automatic loading of incoming large sheets and automatic boxing of finished small pieces, realizing automated production of laser cutting, breaking and rack-mounting, saving labor and improving product quality and production efficiency.

Maximum processable area: 430 mm × 300 mm Laser: 1064 nm&10.6 μm Cutting speed [Depending on product material and thickness]: ≤500 mm/s (depending on product material and thickness)

The equipment adopts picosecond laser filamentation cutting technology combined with CO2 laser splitting technology; after cutting is completed, product splitting and separation can be achieved without chemical etching. It is widely used for laser cutting and splitting of hard and brittle materials such as optical glass, sapphire, and glass covers. Compared with traditional mechanical processing, it features fast cutting speed, high dimensional accuracy, and small chipping.