Medical glass cutting, breaking and rack-mounting production line (BM-19D02)

Maximum operating power: 6000 W Wavelength band: 1060 nm-1080nm Fiber optic interface: QBH

Machinable size: 1400*2650 Processing thickness: 1.6~4.0 mm Feeding method: Compatible with long and short edge feeding

Chamfering of hole edges after laser drilling, reducing microcracks and improving glass strength. CCD vision positioning, fully automated chamfering, supports different thicknesses and hole diameters.

Equipment model: BM-QG30 Laser power [1064nm @＜10ps]: >30 W @1064 nm @<10 ps Effective working area: 300 mm × 300 mm

The equipment adopts picosecond laser filamentation cutting technology and is widely used for laser cutting of hard and brittle materials such as optical glass, sapphire, and glass covers. Compared with traditional mechanical processing, it has excellent features such as fast cutting speed, high dimensional accuracy, and small chipping.;● Short single-point laser action time, small heat-affected zone, no glass debris generated;;● High dimensional accuracy, small chipping, no taper;;● Precision optical path system design with imported lenses, ensuring high-quality laser transmission and good long-term stability;;● Linear motor PSO control, μ-level precision, real-time synchronized path control;;● CCD vision positioning, offset correction and compensation, enabling high-efficiency, high-precision stable processing over a relatively large area;;● Low noise, good environmental friendliness, high cost performance;;● Professionally designed automatic loading/unloading system, saving labor and improving efficiency.;● LCD full-screen cutting;● Glass/sapphire camera cover cutting;● Medical glass cutting;● Wearable product cover cutting;● Filter cutting;● Glass cutting for home appliances, automotive, etc.

Maximum processable area: 430 mm × 300 mm Laser: 1064 nm&10.6 μm Cutting speed [Depending on product material and thickness]: ≤500 mm/s (depending on product material and thickness)

The equipment adopts picosecond laser filamentation cutting technology combined with CO2 laser splitting technology; after cutting is completed, product splitting and separation can be achieved without chemical etching. It is widely used for laser cutting and splitting of hard and brittle materials such as optical glass, sapphire, and glass covers. Compared with traditional mechanical processing, it features fast cutting speed, high dimensional accuracy, and small chipping.