Normal EDFA Series

size: 35x18x5.5 mm, Smaller Input Power: -15~-10dBm Output Power: >4dBm

Mini EDFA series, its main features are small size and low power. Using small components and small bend radius fibers, from half MSA to 35*12*5.5mm, or thin tray products, it realizes single-wave amplification with output power of about 10dBm, mainly used in metro networks and DCO coherent modules.

Stage format: 310 mm × 310 mm X-axis working stroke: 0-600 mm Y1, Y2 axis working stroke: 0-500mm

● Wafer cutting equipment using high-precision bidirectional silent air spindle:; ● Cutting area: 4 inch, 6 inch wafers;; ● High precision: for resin substrates with irregular expansion and contraction, high-precision processing is possible through cutting line calibration at multiple points;; ● Simple and convenient operation: 17-inch touch screen;; ● Automatic blade mark calibration function: automatically measures the offset of the cutting street and the width of the cutting mark, managing processing quality;; ● Blade breakage detection function: blade breakage detection during cutting.; ● 4/6 inch IC, wafer cutting; ● Silicon, quartz, aluminum oxide, iron oxide, gallium arsenide, sapphire, glass, etc.

Stage format: ∅300mm X-axis working stroke: 0-770mm Y1, Y2 axis working stroke: 0-470mm

Large-scale package substrate cutting equipment using opposed, high-precision bidirectional silent air spindles:; ● High production efficiency: basket loading, automatic loading/unloading + automatic cutting + automatic cleaning functions;; ● High precision: for resin substrates with irregular stretchable materials, high-precision processing is possible through multi-point cutting line calibration;; ● Simple and convenient operation: 19-inch touch screen;; ● Automatic calibration function: calibration can be performed by selecting recorded workpiece data;; ● Automatic blade mark calibration function: automatically measures the offset of the cutting street and the width of the cutting mark, managing processing quality;; ● More complete functions: supports diverse full-cut/half-cut processes, a more advanced ∅300mm format cutting machine.; ● Large-scale package substrates; ● IC, LED, QFN, etc.; ● Silicon, quartz, alumina, iron oxide, gallium arsenide, sapphire and glass, etc.

Stage format: 310 mm × 310 mm X-axis working stroke: 0-600 mm Y1, Y2 axis working stroke: 0-500mm

Large-scale package substrate cutting equipment using opposed, high-precision bidirectional silent air spindles:; ● High efficiency: dual spindles cutting simultaneously can increase production efficiency by up to 90% compared with a single-spindle cutting machine;; ● High precision: for resin substrates with irregular stretchable materials, high-precision processing is possible through multi-point cutting line calibration;; ● Simple and convenient operation: 19-inch touch screen;; ● The equipment adopts a marble base and, combined with a high-precision linear motor and vision positioning system, enables large-format, high-efficiency, high-precision and stable processing;; ● Automatic blade mark calibration function: automatically measures the offset of the cutting street and the width of the cutting mark, managing processing quality;; ● Large-scale package substrates; ● IC, LED, QFN, etc.; ● Silicon, quartz, alumina, iron oxide, gallium arsenide, sapphire and glass, etc.