Dual-spindle precision dicing saw (semi-automatic)

size: 35x18x5.5 mm, Smaller Input Power: -15~-10dBm Output Power: >4dBm

Mini EDFA series, its main features are small size and low power. Using small components and small bend radius fibers, from half MSA to 35*12*5.5mm, or thin tray products, it realizes single-wave amplification with output power of about 10dBm, mainly used in metro networks and DCO coherent modules.

Gain ripple [EDFA-BA,PA,LA；typ. condition]: <1.0dB typ. condition NF [EDFA-BA,PA,LA；for typ. C Condition]: <6.0dB for typ. C Condition NF [EDFA-BA,PA,LA；for typ. L Condition]: <6.5dB for typ. L Condition

Normal-type EDFA, including single-wave, multi-wave, pure optical, and powered EDFA, with dimensions above 90*70*15mm, can achieve higher gain and larger power output. There are fixed-gain EDFA as well as adjustable gain and gain-slope EDFA. Gain can be 10~38dB, power can reach 20dBm, even above 27dBm. Typical noise is around 5.5dB. Such amplifiers are widely used in backbone networks and metro networks, widely applied in OTN and PTN, and are one of the important functional components of optical communication systems.

Stage format: 310 mm × 310 mm X-axis working stroke: 0-600 mm Y1, Y2 axis working stroke: 0-500mm

● Wafer cutting equipment using high-precision bidirectional silent air spindle:; ● Cutting area: 4 inch, 6 inch wafers;; ● High precision: for resin substrates with irregular expansion and contraction, high-precision processing is possible through cutting line calibration at multiple points;; ● Simple and convenient operation: 17-inch touch screen;; ● Automatic blade mark calibration function: automatically measures the offset of the cutting street and the width of the cutting mark, managing processing quality;; ● Blade breakage detection function: blade breakage detection during cutting.; ● 4/6 inch IC, wafer cutting; ● Silicon, quartz, aluminum oxide, iron oxide, gallium arsenide, sapphire, glass, etc.

Stage format: ∅300mm X-axis working stroke: 0-770mm Y1, Y2 axis working stroke: 0-470mm

Large-scale package substrate cutting equipment using opposed, high-precision bidirectional silent air spindles:; ● High production efficiency: basket loading, automatic loading/unloading + automatic cutting + automatic cleaning functions;; ● High precision: for resin substrates with irregular stretchable materials, high-precision processing is possible through multi-point cutting line calibration;; ● Simple and convenient operation: 19-inch touch screen;; ● Automatic calibration function: calibration can be performed by selecting recorded workpiece data;; ● Automatic blade mark calibration function: automatically measures the offset of the cutting street and the width of the cutting mark, managing processing quality;; ● More complete functions: supports diverse full-cut/half-cut processes, a more advanced ∅300mm format cutting machine.; ● Large-scale package substrates; ● IC, LED, QFN, etc.; ● Silicon, quartz, alumina, iron oxide, gallium arsenide, sapphire and glass, etc.