Class 100 Clean Oven (YPOZ-270)

Equipment柜体尺寸（宽*深*高） [不含冷水机、操控机箱 and 报警灯]: Approximately 800 mm × 1100 mm × 1800 mm Equipment柜体重量: Approximately 700kg Equipment用电总功率: 15KW; the water chiller additionally consumes approximately8KW

The laser-bar module burn-in system uses parallel water and electrical supply circuits, with 18 parallel channels. Warm water at 35℃ circulates during burn-in, and water flow can be controlled for each channel. Each channel contains a stack of 10 bars rated at 50W per bar, giving 500W total. Maximum burn-in current is 50A, voltage adapts over 0-24V, frequency is adjustable over 1-20Hz, duty cycle is adjustable up to 40%, and pulse width is adjustable over 10-400 ms in 5ms minimum steps. The system comprises temperature control, flow control, burn-in monitoring, and a host computer with control software. Temperature control includes laser-bar cooling modules, temperature sensors, temperature controls and a chiller. Flow control includes flowmeters, regulating valves, piping, and flow-detection and control circuits. Burn-in monitoring includes module press-mounting and power units, cooling modules, optical-power detection, industrial high-power pulsed supplies, voltage and current detection, constant-current control and racks. The host computer and software monitor and control the entire process, displaying all burn-in data in real time and storing it at specified intervals as required.

Equipment尺寸（W X D X H） [此为主机尺寸，不含净风机及报警灯尺寸（高度300mm）]: 1100 mm × 1000 mm × 2000 mm 净风机尺寸（W X D X H）: 400 mm × 600 mm × 1170 mm 主机与净风机之间的间隔: Approximately 100mm

This system meets COS burn-in and measurement requirements at high current and power. It can burn in 216 COS devices simultaneously, with maximum operating current of 20A and optional 30A, 40A or 50A configurations. Power can be cut off if optical power falls or temperature rises, ensuring a safe burn-in process. A host computer displays all data in real time and stores it at specified intervals as required. The system includes temperature stabilization, burn-in monitoring and monitoring software. Temperature control comprises temperature detection and regulation, power supplies and cooling water. Burn-in monitoring comprises imported high-stability, high-power supplies, voltage and current detection, constant-current control circuits and racks. An industrial computer and burn-in monitoring software are included.

The company's newly introduced fully automatic laser-chip burn-in and testing equipment fills a gap in this process equipment domestically and internationally. Benefits include: 1. Extensive functionality: 1 machine replaces 3, with 50A\480PCS capacity, automatic clamping, loading and unloading, data analysis and MES integration. 2. Low costs: 1 machine replaces 3; direct costs are 1.2 million yuan <1.5 million yuan, and labor savings are at least 2-3 workers. 3. High efficiency: uninterrupted 7X24-hour operation, with testing as short as 15s per laser chip. 4. Reduced labor intensity, especially for COS clamping and data collection and analysis. 5. Improved product quality through reduced reliance on skilled workers, elimination of human error and improved consistency. 6. Greater proportional capacity: at least 1.5 times the throughput for the same operating time or floor area. 7. Improved brand value through a fully automated production line. Laser chips are a major semiconductor-chip segment and a key upstream material for the laser industry. Dicing, eutectic die attachment and other upstream processes produce Chip On Submount devices, or COS, referred to here as laser chips. They are core materials for semiconductor, fiber and solid-state lasers. Testing and burn-in are essential during both development and mass production before chips enter downstream laser manufacturing. With no fully automatic laser-chip burn-in and testing equipment currently available on the market, while other manufacturing stages already use fully or partly automated equipment, developing this equipment is necessary for large-scale, fully automated laser production.

中心波长: 532 nm 平均功率: 50 W 脉冲宽度: 10~15 ps

All Knight series industrial picosecond 532 lasers undergo high-temperature burn-in, thermal shock and vibration reliability testing to ensure long-term reliability under 7/24 industrial production conditions. The Knight picosecond green laser provides up to 100 W and pulse energy up to 100μJ. It offers excellent overall performance in precision machining of brittle materials, transparent-material processing, coating removal from 3C products, precision ceramic marking and cutting optoelectronic modules such as fingerprint and camera modules.

中心波长: 532 nm 平均功率: 100 W 脉冲宽度: 10~15 ps

All Knight series industrial picosecond 532 lasers undergo high-temperature burn-in, thermal shock and vibration reliability testing to ensure long-term reliability under 7/24 industrial production conditions. The Knight picosecond green laser provides up to 100 W and pulse energy up to 100μJ. It offers excellent overall performance in precision machining of brittle materials, transparent-material processing, coating removal from 3C products, precision ceramic marking and cutting optoelectronic modules such as fingerprint and camera modules.