Fully automatic COS Burn-in test system
The company's newly introduced fully automatic laser-chip burn-in and testing equipment fills a gap in this process equipment domestically and internationally. Benefits include: 1. Extensive functionality: 1 machine replaces 3, with 50A\480PCS capacity, automatic clamping, loading and unloading, data analysis and MES integration. 2. Low costs: 1 machine replaces 3; direct costs are 1.2 million yuan <1.5 million yuan, and labor savings are at least 2-3 workers. 3. High efficiency: uninterrupted 7X24-hour operation, with testing as short as 15s per laser chip. 4. Reduced labor intensity, especially for COS clamping and data collection and analysis. 5. Improved product quality through reduced reliance on skilled workers, elimination of human error and improved consistency. 6. Greater proportional capacity: at least 1.5 times the throughput for the same operating time or floor area. 7. Improved brand value through a fully automated production line. Laser chips are a major semiconductor-chip segment and a key upstream material for the laser industry. Dicing, eutectic die attachment and other upstream processes produce Chip On Submount devices, or COS, referred to here as laser chips. They are core materials for semiconductor, fiber and solid-state lasers. Testing and burn-in are essential during both development and mass production before chips enter downstream laser manufacturing. With no fully automatic laser-chip burn-in and testing equipment currently available on the market, while other manufacturing stages already use fully or partly automated equipment, developing this equipment is necessary for large-scale, fully automated laser production.
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