Laser bar module burn-in system

Equipment尺寸（W X D X H） [此为主机尺寸，不含净风机及报警灯尺寸（高度300mm）]: 1100 mm × 1000 mm × 2000 mm 净风机尺寸（W X D X H）: 400 mm × 600 mm × 1170 mm 主机与净风机之间的间隔: Approximately 100mm

This system meets COS burn-in and measurement requirements at high current and power. It can burn in 216 COS devices simultaneously, with maximum operating current of 20A and optional 30A, 40A or 50A configurations. Power can be cut off if optical power falls or temperature rises, ensuring a safe burn-in process. A host computer displays all data in real time and stores it at specified intervals as required. The system includes temperature stabilization, burn-in monitoring and monitoring software. Temperature control comprises temperature detection and regulation, power supplies and cooling water. Burn-in monitoring comprises imported high-stability, high-power supplies, voltage and current detection, constant-current control circuits and racks. An industrial computer and burn-in monitoring software are included.

The company's newly introduced fully automatic laser-chip burn-in and testing equipment fills a gap in this process equipment domestically and internationally. Benefits include: 1. Extensive functionality: 1 machine replaces 3, with 50A\480PCS capacity, automatic clamping, loading and unloading, data analysis and MES integration. 2. Low costs: 1 machine replaces 3; direct costs are 1.2 million yuan <1.5 million yuan, and labor savings are at least 2-3 workers. 3. High efficiency: uninterrupted 7X24-hour operation, with testing as short as 15s per laser chip. 4. Reduced labor intensity, especially for COS clamping and data collection and analysis. 5. Improved product quality through reduced reliance on skilled workers, elimination of human error and improved consistency. 6. Greater proportional capacity: at least 1.5 times the throughput for the same operating time or floor area. 7. Improved brand value through a fully automated production line. Laser chips are a major semiconductor-chip segment and a key upstream material for the laser industry. Dicing, eutectic die attachment and other upstream processes produce Chip On Submount devices, or COS, referred to here as laser chips. They are core materials for semiconductor, fiber and solid-state lasers. Testing and burn-in are essential during both development and mass production before chips enter downstream laser manufacturing. With no fully automatic laser-chip burn-in and testing equipment currently available on the market, while other manufacturing stages already use fully or partly automated equipment, developing this equipment is necessary for large-scale, fully automated laser production.

中心波长: 532 nm 平均功率: 50 W 脉冲宽度: 10~15 ps

All Knight series industrial picosecond 532 lasers undergo high-temperature burn-in, thermal shock and vibration reliability testing to ensure long-term reliability under 7/24 industrial production conditions. The Knight picosecond green laser provides up to 100 W and pulse energy up to 100μJ. It offers excellent overall performance in precision machining of brittle materials, transparent-material processing, coating removal from 3C products, precision ceramic marking and cutting optoelectronic modules such as fingerprint and camera modules.

中心波长: 532 nm 平均功率: 100 W 脉冲宽度: 10~15 ps

All Knight series industrial picosecond 532 lasers undergo high-temperature burn-in, thermal shock and vibration reliability testing to ensure long-term reliability under 7/24 industrial production conditions. The Knight picosecond green laser provides up to 100 W and pulse energy up to 100μJ. It offers excellent overall performance in precision machining of brittle materials, transparent-material processing, coating removal from 3C products, precision ceramic marking and cutting optoelectronic modules such as fingerprint and camera modules.