Skinsecond laser tablet equipment LUD3210
High quality of processing, wideness of cutting lines (in the case of UV; cutting lines in width +HAZ20(2)(5 μm); small drop edges (1010 μm); high processing efficiency UPH≥10 (in the case of an UV lens; 3-inch double-stage silicon diode crystals; including automatic position time); high processing stability Laser pulse stability (≤2% rms); high beam mass (M21.21.2)
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Overview
Specifications
| Parameter | Value |
|---|---|
| Central wavelength | ~355nm |
| Process Head | Laser straight |
| Effective schedule | 200 x 300 mm (selection), DD motor |
| Repeat location precision | ±2μm 、 ± 5arc sec |
| Visual positioning | Heads up. Heads up |
| Line width | ≤20± 5 μm |
| Specification of electricity supply | 220V/50Hz/3.5 kW |
Key Features
Datasheet
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