General intelligence equipment for glass laser cutting fragments
Infrared-skin-second lasers; filamentation and CO2 fragmentation; full auto-processing of cutting chips; fast, high accuracy and greater compatibility; and rapid alien cutting of a wide range of constrictive materials such as mobile phones, watch protection panels and window glass
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Overview
Specifications
| Parameter | Value |
|---|---|
| Average output power | ≥60W |
| Pulse width | ＜10ps |
| Single pulse energy | ＞400uj（100KHz） |
| Cut your head for head processing | HG homemade |
| Line-wire power process | 1500mm 1600mm |
| System Pixels | 11 million pixels, position accuracy 0.003 mm (selected) |
| Thickness of cutting product | ≤3mm |
| Gradient | ＜1° |
| Reconciliation | Electric focal (selection) |
| Specification of electricity supply | 220V/50HZ/8KW |
| Environmental requirements | Temperature 20 ~ 26 °C and humidity 50 ~ 5% |
| Equipment weight | About 5T |
Applications
Key Features
Datasheet
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