Home All Products Optomechanics & Accessories Packages Encapsulating module laser opening equipment Lus 3210
Encapsulating module laser opening equipment Lus 3210
Packages

Encapsulating module laser opening equipment Lus 3210

Supplier
Hglaser
Category
Packages
Origin
China

Laser-opening equipment uses high-energy laser beams to evaporate, gasrate, chemically act, burn, etc., on the surface of the chip; thereby removing the chip's plastic cover; exposing chips, fuses, frames and even panels; facilitating failure analysis

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Overview

Laser-opening equipment uses high-energy laser beams to evaporate, gasrate, chemically act, burn, etc., on the surface of the chip; thereby removing the chip's plastic cover; exposing chips, fuses, frames and even panels; facilitating failure analysis

Key Features

Custom laser programmable removal; removal range 10-800 mm per layer; no residue, no sinter; maximum processing range 200 x 200 mm; suitable for larger size opening; coaxial observation; real-time display and recording of opening process; non-polar mutation focus; clear observation of opening chip status

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Supplier Information

Hg
Hglaser
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Wuhan Huagong Laser Engineering Co., Ltd. is the pioneer and leader of laser industrial application in China, and an authoritative global provider of laser processing solutions. The company comprehensively deploys laser intelligent equipment, measurement and automation production lines, and smart factory construction, providing overall solutions for intelligent manufacturing. With nearly 3,000 employees, nearly 100 offices worldwide, and about 800 national patents, its products cover full-power series of laser cutting equipment, laser welding equipment, laser cleaning equipment, laser marking equipment, laser heat treatment equipment, and extend to automated production lines and smart factory overall solutions.

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Encapsulating module laser opening equipment Lus 3210
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