Specifications
| Parameter | Value |
|---|---|
| Net Weight | 2400 kg |
| Wafer Loading Specification | 8-inch cassette; 12-inch standard FOUP |
| Minimum Wafer Defect Size | 1.5 μm |
| Minimum Packaged Device/PCB Defect Size | 15 μm |
| Ranging Accuracy | 5 μm |
| Height Measurement Accuracy | 5 μm |
| Wafer Throughput | 60 wafers/hour (8-inch wafer) |
| PCB Throughput | 1100 or 2100 components/hour, depending on component size |
| ESD Class | Class 1 |
| Power Requirement | 220 V, 50 Hz, 20 A |
| Air Supply Requirement | 0.5–0.7 MPa, φ8 mm inlet tube |
| Working temperature | 20–26 °C |
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Supplier Information
Tianjin HCHiptech Technology Group Co., Ltd. was established in November 2017. It is a professional manufacturer of micro-nano optoelectronic chips, a national high-tech enterprise, and one of Tianjin's first gazelle enterprises. The company focuses on the design, R&D and production of optoelectronic chips such as lasers, modulators, and superstructures. It has 8,000 square meters of clean laboratories and 18,000 square meters of industrialization base, serving more than 500 customers. Its products are widely used in optical communication, autonomous driving, augmented reality, intelligent sensing and other fields.
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