Flight-second laser-cutting drilling system
The Roban-Drill series flight-second laser cut-off system is equipped with a high-frequency flying-second laser amplifier (optional model); high-speed scanning persimmons and high-precision straight-line migration table. High-speed scanning cutting of hardware for higher education and scientific institutions; blind holes, vents and their mass-control processing; material surface silos, etc
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Overview
Specifications
| Parameter | Value |
|---|---|
| Light | Flight seconds laser amplifier (1030 nm/515 nm, 1-200 kHz) |
| Process materials | Sapphire, stone, silicone and silicon carbide |
| Drilling aperture | 20 μm - 20 mm |
| Maximum Scan Speed | 200 mm/s |
| Sample thickness | 0.1 mm - 3 mm |
| Position precision | ±3 μm |
| Processing data formats | DXF and automated data generation based on processing graphic parameters |
| System exterior dimensions | 600 mm (L) × 500 mm (W) × 800 mm (H) |
| Electrical requirements | 200 ~ 240 VAC, 50/60 Hz, 5 kW |
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Key Features
Datasheet
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