NLM series multi-modular two-wave narrow-wire laser
The NLM series RealStable, multi-mode two-wave narrow-wire laser is a patented product of almonds. This series of products achieves a two-way narrow-wire, steady wavelength laser switching output; and meets the special applications of the Laman spectral industry. Laser contains the upper control software; monitors the condition of the laser; and supports online updates of laser solids. More wavelength combinations acceptable for customisation
Save to Favorites
Overview
Specifications
| Parameter | Value |
|---|---|
| Output Power | 500/500; 500/800mW |
| The wavelength is different | ± 0.5 (each wavelength)nm |
| Width | < 0.1 (per wavelength)nm |
| Wavelength stability@4h | ±7 pm |
| Power stability@4h | ±2%(P-P) |
| Border Model Impression Ratio | 40dB |
| Central wavelength | 784/785; 785/1064nm |
| Power adjustment range | 0~100% |
| Preheat time | 15min |
| Modem Input | Simulation signal 0-5V |
| Fibre interface | FC/PC, SMA905 |
| Fitable fibres | 105 μm, NA0.22 |
| System usage | <20 W Typ |
| System Weight | 1.2kg |
| System Dimensions | 180×102×180.2mm |
Applications
Key Features
Datasheet
Supplier Information
Related Products
-
AMB/DBC Substrate CO2 Laser Scribing Machine CPP12
Semiconductor Packaging Equipment
Delphilaser
Equipment Type: Single Head, Single Platform, Standalone/Automated Working area: 200mm×200mm(customizable) Positioning accuracy: ±3μm
This equipment is mainly used for laser scribing in the DBC industry and is widely used in packaging fields such as power electronic modules, semiconductor cooling and LED devices.
-
AMB/DBC Substrate CO2 Laser Scribing Machine CPP21
Semiconductor Packaging Equipment
Delphilaser
Equipment Type: Dual Heads, Dual Platforms, Automated Working area: 200mm×200mm(customizable) Positioning accuracy: ±3μm
This equipment is mainly used for laser scribing in the DBC industry and is widely used in packaging fields such as power electronic modules, semiconductor cooling and LED devices.
-
AMB/DBC Substrate CO2 Laser Scribing Machine CPP30
Semiconductor Packaging Equipment
Delphilaser
Equipment Type: Single Head, Single Platform, Automated Working area: 200mm×200mm(customizable) Positioning accuracy: ±3μm
This equipment is mainly used for laser scribing in the DBC industry and is widely used in packaging fields such as power electronic modules, semiconductor cooling and LED devices.
-
Compact Air-Cooled Nanosecond Laser All-in-One Unit Coral-A Series Coral UV-A
Semiconductor Packaging Equipment
Bellinlaser
Spot Mode: TEM₀₀(M²<1.3) Beam diameter: 0.5-1mm Power stability [RMS over 8 hours]: <3% RMS over 8 hours
-
Compact Air-Cooled Nanosecond Laser All-in-One Unit Coral-A Series Coral GR-A
Semiconductor Packaging Equipment
Bellinlaser
Spot Mode: TEM₀₀(M²<1.3) Beam diameter: 0.5-1mm Power stability [RMS over 8 hours]: <3% RMS over 8 hours
Related Articles
In photonics and laser technology, devices that manipulate optical signals via the electro-optic effect form the backbone of precision optical systems. Electro-optic phase modulators and electro-optic deflectors are two prominent examples of this device category. As a critical hardware solution for high-speed, high-accuracy laser beam direction control, electro-optic deflectors are widely deployed across industrial and research settings. Below is a detailed overview of their core structure, key performance drivers, and primary use cases.
As a top‑tier supplier of tunable laser chips, Shandong Zhongxin Optoelectronics Technology Company has newly launched the world’s first budget‑friendly fiber‑Bragg‑grating (FBG) demodulator and scanning module.
A laser bar is an array semiconductor laser chip integrated with dozens of emitters, which realizes hundred-watt quasi-continuous output on a single chip. With regular emitter arrangement and controllable fill factor, integrated thermal design and superior wall-plug efficiency compared to single chips, it acts as the core light source for high-power pumping, medical lasers and precision processing.
BEIJING JIEPU TREND supplies YAG+Er:YAG+YAG bonded composite slab laser crystals for high‑power solid‑state laser systems. The monolithic slab consists of two undoped YAG end‑cap layers and a central Er‑doped YAG gain segment. The overall dimension is 9 mm×9 mm×9 mm.
Loading...
Name
Phone
Organization
Use Case
Database Platform