While achieving high-precision measurement, the AM-8000 series also offers more efficient intelligent control: one-key automatic workpiece finding, focusing and leveling, with an XY-axis measurement range up to 300×300mm, meeting Mapping multi-point measurement, aspheric K-value measurement and other needs.; Compared with the AM-7000 series, the AM-8000 series platform has a 3x larger travel, 2.5x higher load capacity, 50% better positioning accuracy and 30% faster moving/stitching speed, supports more interferometric objectives and covers a wider range of application scenarios. Widely used in semiconductors, precision optics, 3C, new energy and other fields, providing efficient solutions for micro-nano structure measurement and roughness inspection.
| Parameter | Value |
| Accuracy | 0.03nm |
| XY Axis Measurement Range | Up to 300×300 mm |
| Stage Travel | 3 times improvement over the AM-7000 series |
| Load Capacity | 2.5 times improvement over the AM-7000 series |
| Positioning Accuracy | 50% improvement over the AM-7000 series |
| Travel Stitching Speed | 30% improvement over the AM-7000 series |
Roughness, Micro-topography, Step Height, Flatness; Application Examples: Roughness Grinding Marks-Roughness Mica-Surface Topography Roughness Flank Face-Roughness Rake Face-Roughness Lens-Roughness Gear Splicing-Roughness Metal-Surface Texture Roller-Surface Roughness Copper Foil-Roughness Implant-Roughness/Topography Dimensions Copper Foil-Roughness Gyroscope Lens-Roughness Wafer-Roughness Precision Polishing-Roughness HUD Glass-Roughness Gear-Surface Roughness Laser-machined Parts-Topography/Surface Roughness Optical Module Liquid-cooling Plate-3D Topography/Surface Roughness PCR Tube-Inner Wall Roughness Denture-3D Profile/Surface Roughness Ultra-smooth Lens-Surface Roughness 3D Printed Metal Samples-Surface Roughness 3D Printed Aspherical Lens-Surface Roughness; Height/Height Difference OLED-Surface Dimensions PV Grid Lines-Height; 3D Topography PCB Dimensions-3D Topography Capacitor Component Surface-3D Topography Phone Glass Cover Scratches-3D Topography Bumping-3D Topography Wafer Surface Etching-3D Topography Wafer Etching-3D Topography Wafer Cutting Depth-3D Topography Photomask-3D Topography Lens Mold-3D Topography Microlens Compound Eye-3D Topography Cylindrical Lens-3D Topography Float Glass-Surface 3D Topography Optical Flat Mirror-Roughness Silicon Wafer-Surface Pyramid Structure Laser Line Depth-3D Topography Metal Grid Lines-3D Topography Cylindrical Lens-Radius of Curvature Microfluidics-Topography Dimensions Phone Switch-Topography Dimensions Asphere-K Value Nanoimprint-Topography Dimensions Laser Processing-Topography Dimensions MEMS Devices-Topography Dimensions Micro-motion Friction-Friction Volume Plow Grooves-Area Measurement LIBS Ablation Crater-Topography Depth/Volume/Step Microlens Array-Micro 3D Topography Diamond Wafer-Surface Roughness, Flatness Microfluidic Chip-Surface Roughness/Micro-channel Height and Width Fresnel Lens-Radius of Curvature/Surface Figure PV Value; 3D Dimensions Headlamp Array-Radius of Curvature; 2D Dimensions Chip-2D Dimensions Glass Substrate-TGV Hole Dimensions; Flatness Ceramic Substrate-Flatness Periscope-Flatness; Step Height Step-Height Height Difference-Chip Height Measurement Height Difference-Character Depth PCB Gold Fingers PCB Blind Vias-Step Height Metal Parts-Topography/Step Metal Spacer-Step Height/Topography; 2D Profile Cylindrical Lens Array-2D Profile Fresnel Lens-Angle Spherical Mirror Array-Radius of Curvature Microlens-Radius of Curvature
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Banshi Intelligent Technology (Shenzhen) Co., Ltd. (brand: Atometrics) was established in 2017, headquartered in Shenzhen. It is a national-level specialized and sophisticated 'Little Giant' enterprise and a high-tech enterprise, focusing on high-precision measuring instruments and semiconductor metrology and inspection equipment. The company has launched various high-precision measurement products such as white light interferometers, flash measuring instruments, super depth-of-field microscopes, laser sensors, spectral confocal sensors, wafer 3D metrology equipment, etc., which are widely used in semiconductors, aerospace, 3C electronics, 5G communication, new energy, biomedical and other fields. Major customers include Huawei HiSilicon, CATL, Chinese Academy of Sciences, and other well-known enterprises, committed to exploring the future of humanity with precision measurement.