Resin-Bond Dicing Blade

Resin-Bond Dicing Blade

Supplier
Zzqsjm
Category
Tools and Machinery
Origin
China

Precision cutting and grooving of precision components such as semiconductor packaging materials (QFN), optical glass, quartz glass, ceramic materials, etc

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Overview

Precision cutting and grooving of precision components such as semiconductor packaging materials (QFN), optical glass, quartz glass, ceramic materials, etc

Applications

Package Material (QFN), Optical Glass, Quartz Glass, Ceramic Material

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Supplier Information

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Zzqsjm
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<p>Since its establishment in 2014, Qisheng Precision has been focusing on the semiconductor and precision manufacturing industry, specializing in R&D and manufacturing of dicing equipment, superhard tools, and precision grinding products. It is one of the few high-tech enterprises in China that truly achieves dual-track independent R&D of "equipment + tools". Core strengths: integrated R&D and manufacturing, three business divisions, full-chain capability; professional R&D team mastering core technologies. Core products: precision dicing machines, full series of dicing blades (electroformed, resin, metal), precision grinding products (thinning wheels, ceramic chucks, etc.). Applications: integrated circuits, LED chips, optical components, new energy batteries, electronic ceramics, magnetic materials. Served thousands of enterprises across 30 provinces. Vision: Perseverance, proactiveness, harmonious work, self-transcendence; striving for innovation and precision.</p>

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Resin-Bond Dicing Blade
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