APX-520B

APX-520B

Supplier
Santec
Part Number
APX-520B
Category
Other
Origin
China

The APX-520B is a PCI Express add-in board for high-speed data acquisition and real-time image processing. It integrates a large-scale FPGA cooled by an active fan heatsink, a SO-DIMM socket populated with a SanMax Technologies memory module for onboard data buffering, and multiple high-efficiency Linear Technology µModule power regulators (LTM4627, LTM4601EV) for stable power delivery. External connectivity is provided through four gold-plated SMA coaxial connectors and one high-density 26-pin I/O connector on the mounting bracket, while a second passive heatsink ensures reliable thermal performance during continuous operation. The board is designed for OEMs and system integrators building machine vision, industrial imaging and high-speed measurement systems.

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Overview

The APX-520B is a PCI Express add-in board for high-speed data acquisition and real-time image processing. It integrates a large-scale FPGA cooled by an active fan heatsink, a SO-DIMM socket populated with a SanMax Technologies memory module for onboard data buffering, and multiple high-efficiency Linear Technology µModule power regulators (LTM4627, LTM4601EV) for stable power delivery. External connectivity is provided through four gold-plated SMA coaxial connectors and one high-density 26-pin I/O connector on the mounting bracket, while a second passive heatsink ensures reliable thermal performance during continuous operation. The board is designed for OEMs and system integrators building machine vision, industrial imaging and high-speed measurement systems.

Specifications

ParameterValue
ModelAPX-520B
PCB Part NumberPC17045A
Bus InterfacePCI Express
Form FactorFull-Height PCIe Add-In Card with Bracket
Onboard MemorySanMax Technologies SO-DIMM Module
Memory Socket1×SO-DIMM
Main Power ModuleLinear Technology LTM4627 µModule
Auxiliary Power ModuleLinear Technology LTM4601EV µModule
Coaxial Connectors4×SMA (Gold-Plated)
I/O Connector1×26-Pin High-Density Connector
Cooling MethodActive Fan Heatsink + Passive Heatsink
PCB Flammability Rating94V-0

Applications

1. Machine vision inspection and quality control 2. High-speed image acquisition and real-time image processing 3. Industrial automation and factory automation 4. Medical imaging systems 5. Semiconductor and electronics inspection 6. Scientific research and laboratory measurement 7. High-speed signal acquisition and test & measurement

Key Features

1. PCI Express high-speed host interface for fast data transfer 2. Large-scale FPGA with active fan cooling for real-time onboard processing 3. SO-DIMM socket for expandable onboard memory buffering 4. Multiple high-efficiency Linear Technology µModule regulators for clean and stable power rails 5. Four gold-plated SMA coaxial connectors for high-speed analog, clock or trigger signals 6. High-density 26-pin I/O connector for flexible external interfacing 7. Dual-heatsink thermal design for reliable continuous operation

Datasheet

Product Datasheet
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Supplier Information

Sa
Santec
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<p><span style="color: rgb(15, 17, 21); background-color: rgb(255, 255, 255); font-size: 16px;">Santec (Shanghai) Co., Ltd., a wholly-owned subsidiary of Japan's Santec Holdings, was established in Pudong, Shanghai in 2001. It specializes in optical communications, testing instruments, and optical imaging, offering tunable lasers, optical components, and OCT systems. The company provides advanced optical measurement and sensing solutions to the Chinese market.</span></p>

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