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Photonics Source provides 11 products. Download datasheets, request quotes, and compare function, price, and availability.
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Precision Metal Shim Ring (Laser-Engraved Optical Spacer Washer) 58×0.15×40mm
Overall Dimensions: 58×0.15×40mm Outer Diameter: 58mm Thickness: 0.15mm Inner Diameter: 40mm Part Number: H4Z1001-8 -
High-precision Automatic Die Bonder
Placement Accuracy: ±5um @3 sigma; ±3um (Standard Die) Placement Angle Accuracy: ±0.3° @3 sigma Bonding Force: 10gf~200gf (Programmable) Single Die Bonding Time: ≤6s Dispensing System: Glue Dipping or Glue Writing -
粗线键合焊线机 XB-7024（Heavy Wire Bonder）
Work Area X-axis: 60mm/0.1um Work Area Y-axis: 100mm/0.1um Work Area Z-axis: 55mm/0.05um Work Area T-axis: ±220°/0.01° Wire Diameter Range: 4mil-20mil(100um-500um) -
Module Wire Bonding Machine
Working Area X Axis: 300mm/0.05um Working Area Y Axis: 300mm/0.05um Working Area Z Axis: 50mm/0.05um Working Area T Axis: ±220°/0.01° Wire Diameter Range: 4mil-20mil(100um-500um) -
multiple模光器 Items耦合机
Standard Model: 单四轴，双四轴，双六轴 Coupling Packaging Process Type: SR1，SR4，SR8，AOC Compatible Coupling Component Type: 透镜，透镜阵列，COB，FA -
Single-mode Optical Device Coupling Machine (单模光器 Items耦合机)
Standard Models: 单Lens耦合，双Lens耦合，单FA耦合，双FA耦合 Supported Packaging Types and Processes: BOX，COB，陶瓷基板（Ceramic Substrate），SIOB，PLC芯片（PLC Chip），硅光芯片（Silicon Photonics Chip），COC To PIC，SIOB，COC To FA，COC To Collimator，V-groove Applicable Product Types for Coupling Production: CWDM，DR系列（DR Series），FR系列（FR Series），光引擎（Optical Engine），LR4，ER4，SOA（半导体光放大器），可调激光器（Tunable Laser），相干类Products（Coherent Products），激光传感器（Laser Sensor），RGB激光Products（RGB Laser Products） Applicable Components for Coupling: 透镜（Lens），透镜阵列（Lens Array），棱镜（Prism），FA，BLOCK，光纤（Fiber），MUX，DMUX，准直器（Collimator），适配器（Adapter），SIOB，COC，PIC Position Repeatability: ±50nm -
ULVAC SAI-200CT
Working Pressure: 0.1-10Pa Target Size: 200mm Deposition Rate: Up to 100nm/min Substrate Size: Up to 8 inches Vacuum Level: ≤10^-6Pa
