Lateral Beam Displacement Module Haas-Shift
Haas-Shift Laterally Offsets Beam so Deep Groove/Hole Edges Do Not Occlude It,Adjusts Cut Verticality;Works with Galvos,Dual Wedges,Dove/Other Scanners for Taper Control.
Save to Favorites
Overview
Specifications
| Parameter | Value |
|---|---|
| Lateral Displacement [Independent Technical Table / Features] | 0.2~8 mm |
| Maximum Rotational Speed [Independent Technical Table / Features] | 6000 rpm |
| Wavelength [Independent Technical Table; Optional Combinations Retained] | 1030&515nm/343&515nm/750-850nm |
| Clear Aperture Dimension [Independent Technical Table; Features Separately State ≥25.4mm, Retained by Source Region] | Φ25.4 |
| Electrical Interface [Independent Technical Table] | USB |
Key Features
Datasheet
Supplier Information
Related Products
-
Open Single Table Sheet Laser Cutting Machine BLS3015
Laser Processing Equipment
Auroralaser
Working Area: 3000*1500 Table Load Bearing: 2000 kg Overall Dimensions: 4850 mm × 2330 mm × 1920 mm
BLS Series Open Single Table Sheet Laser Cutting Machine The “single table” and “open-frame” design are ideal solutions for sheet metal processing scenarios that prioritize cost-effectiveness, operational convenience, and flexible adaptability.
-
Open Single Table Sheet Laser Cutting Machine BLS4015
Laser Processing Equipment
Auroralaser
Working Area: 4000*1500 Table Load Bearing: 2500 kg Overall Dimensions: 5850 mm × 2330 mm × 1920 mm
BLS Series Open Single Table Sheet Laser Cutting Machine The “single table” and “open-frame” design are ideal solutions for sheet metal processing scenarios that prioritize cost-effectiveness, operational convenience, and flexible adaptability.
-
Open Single Table Sheet Laser Cutting Machine BLS6015
Laser Processing Equipment
Auroralaser
Working Area: 6000*1500 Table Load Bearing: 3500 kg Overall Dimensions: 7920 mm × 2330 mm × 1920 mm
BLS Series Open Single Table Sheet Laser Cutting Machine The “single table” and “open-frame” design are ideal solutions for sheet metal processing scenarios that prioritize cost-effectiveness, operational convenience, and flexible adaptability.
-
Open Single Table Sheet Laser Cutting Machine BLS6020
Laser Processing Equipment
Auroralaser
Working Area: 6000*2000 Table Load Bearing: 5000 kg Overall Dimensions: 7920 mm × 2880 mm × 1920 mm
BLS Series Open Single Table Sheet Laser Cutting Machine The “single table” and “open-frame” design are ideal solutions for sheet metal processing scenarios that prioritize cost-effectiveness, operational convenience, and flexible adaptability.
-
Laser Cutting
Laser Processing Equipment
Jmwafer
Laser cutting is a precise, noncontact process widely used in advanced wafer-semiconductor manufacturing. A focused high-energy beam locally melts or vaporizes material through photothermal effects. Wavelength, power and pulse width are adjusted to material properties for optimal cuts. 晶沐光电 has its own laser-processing line with UV/ultrafast lasers, wafer infrared stealth-dicing and cleaving machines, infrared fiber cutting machines and other equipment for varied wafer-cutting needs.
Related Articles
Laser pump sources are the core energy input component of solid-state lasers and laser amplifiers, and their performance directly determines the output power, beam quality and service life of the entire laser system. In scenarios such as industrial processing, scientific research experiments and high-end equipment, improper pump source selection will not only result in substandard system performance, but also bring a series of problems such as rapid device degradation and high operation and maintenance costs. This article sorts out the core selection logic and key pitfalls of pump source procurement, and provides selection references based on mature, mass-produced high-reliability products to help purchasers efficiently screen suitable products.
Shandong Haucore Optoelectronics Co., Ltd. introduces the HGLD‑792‑COS‑D‑10WB semiconductor laser within its COS series. Delivering an output power of 10 W at a central wavelength of 792 nm, this device adopts gold‑tin bonding COS packaging. Featuring high reliability and long service life, it serves as a preferred pump source for solid‑state lasers and is widely deployed in industrial processing, laser display, medical & aesthetic treatment, scientific research and other fields.
Fomoptic delivers integrated one‑stop optical solutions covering precision optical fabrication and custom vacuum coating services. Supported by complete processing production lines, comprehensive metrology equipment and experienced engineering team, we provide full‑chain customized components, ranging from blank shaping, ultra‑precision polishing to thin‑film coating, for laser systems, infrared imaging, industrial optics and scientific‑research projects.
Fiber lasers and fiber amplification systems require excitation sources with stable wavelength, narrow spectral linewidth and consistent output power.
Loading...
Name
Phone
Organization
Use Case
Database Platform