Laser Cutting
Laser cutting is a precise, noncontact process widely used in advanced wafer-semiconductor manufacturing. A focused high-energy beam locally melts or vaporizes material through photothermal effects. Wavelength, power and pulse width are adjusted to material properties for optimal cuts. 晶沐光电 has its own laser-processing line with UV/ultrafast lasers, wafer infrared stealth-dicing and cleaving machines, infrared fiber cutting machines and other equipment for varied wafer-cutting needs.
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