IDS_B03 High-Speed Interferometer Data Acquisition Module IDS-B03

This dual-frequency laser interferometer uses heterodyne interferometry and conventional free-space optical transmission for resolution down to 0.077nm. Excellent measurement and real-time closed-loop feedback serve subnanometer/nanometer metrology in semiconductor equipment and length measurement. A signal-processing card demodulates phase and outputs displacement through a high-speed port. The motion-measurement/control processor offers high resolution/speed, low noise/latency, real-time feedback and multi-axis measurement. Four- and eight-channel temperature-acquisition modules combine precision acquisition cards with temperature, pressure and humidity probes for multipoint environmental data and real-time wavelength compensation. 锐云威科技 offers a VME system integrating interferometer modules, acquisition software and a development environment. The note identifies the signal-processing card and temperature/pressure/humidity module as distributed products from 拍频光电.

Vertical Resolution [Parameter image_01 Specifications; NanoMez Series; original model column 500]: VSI,VEI <0.5nm；VPI <0.1nm Lateral Resolution [Parameter image_01 Specifications; NanoMez Series; original model column 500; depends on magnification]: 0.05~7.2 μm Height Repeatability [Parameter Figure _01 Specifications;NanoMez Series;Source Model Column500;@1σ]: ≤0.3%

Based on the most advanced non-contact 3D profilometry technique, WLI(white Light Interferometry) technology, the NanoMez® Series WL3000F precisely analyzes patterns from 1 nm to 10 nm in height to measure nano-unit surface geometry with fast, accurate and high detection power. In particular, we provide you with an excellent custom solution for 3D topography & structure analysis such as WLP process micro CDs. By using WLI profilometer technology as basic engine, module base sensor such as Confocal, AFM, Stylus, IRW, Triangle and Moire can be easily detached and optimized for measurement objects such as 3D structure analysis, thin film thickness. Metrology is the most flexible, multi-purpose metrology system available. NanoMez software allows various customized program for the specific metrology works. That is the key factor of superiority of series, NanoMez.

Vertical Resolution [Parameter image_01 Specifications; NanoMez Series; original model column 1000]: VSI,VEI <0.5nm；VPI <0.1nm Lateral Resolution [Parameter image_01 Specifications; NanoMez Series; original model column 1000; depends on magnification]: 0.05~7.2 μm Height Repeatability [Parameter image_01 Specifications; NanoMez Series; original model column 1000; @1σ; Standard Height]: ≤0.1%

Based on the most advanced non-contact 3D profilometry technique, WLI(white Light Interferometry) technology, the NanoMez® Series WL3000F precisely analyzes patterns from 1 nm to 10 nm in height to measure nano-unit surface geometry with fast, accurate and high detection power. In particular, we provide you with an excellent custom solution for 3D topography & structure analysis such as WLP process micro CDs. By using WLI profilometer technology as basic engine, module base sensor such as Confocal, AFM, Stylus, IRW, Triangle and Moire can be easily detached and optimized for measurement objects such as 3D structure analysis, thin film thickness. Metrology is the most flexible, multi-purpose metrology system available. NanoMez software allows various customized program for the specific metrology works. That is the key factor of superiority of series, NanoMez.

Vertical Resolution [Parameter image_01 Specifications; NanoMez Series; original model column 2000]: VSI,VEI <0.5nm；VPI <0.1nm Lateral Resolution [Parameter image_01 Specifications; NanoMez Series; original model column 2000; depends on magnification]: 0.05~7.2 μm Height Repeatability [Parameter image_01 Specifications; NanoMez Series; original model column 2000; @1σ; Standard Height]: ≤0.1%

Based on the most advanced non-contact 3D profilometry technique, WLI(white Light Interferometry) technology, the NanoMez® Series WL3000F precisely analyzes patterns from 1 nm to 10 nm in height to measure nano-unit surface geometry with fast, accurate and high detection power. In particular, we provide you with an excellent custom solution for 3D topography & structure analysis such as WLP process micro CDs. By using WLI profilometer technology as basic engine, module base sensor such as Confocal, AFM, Stylus, IRW, Triangle and Moire can be easily detached and optimized for measurement objects such as 3D structure analysis, thin film thickness. Metrology is the most flexible, multi-purpose metrology system available. NanoMez software allows various customized program for the specific metrology works. That is the key factor of superiority of series, NanoMez.

Vertical Resolution [Parameter image_01 Specifications; NanoMez Series; original model column 3000]: VSI,VEI <0.5nm；VPI <0.1nm Lateral Resolution [Parameter image_01 Specifications; NanoMez Series; original model column 3000; depends on magnification]: 0.05~7.2 μm Height Repeatability [Parameter image_01 Specifications; NanoMez Series; original model column 3000; @1σ; Standard Height]: ≤0.1%

Based on the most advanced non-contact 3D profilometry technique, WLI(white Light Interferometry) technology, the NanoMez® Series WL3000F precisely analyzes patterns from 1 nm to 10 nm in height to measure nano-unit surface geometry with fast, accurate and high detection power. In particular, we provide you with an excellent custom solution for 3D topography & structure analysis such as WLP process micro CDs. By using WLI profilometer technology as basic engine, module base sensor such as Confocal, AFM, Stylus, IRW, Triangle and Moire can be easily detached and optimized for measurement objects such as 3D structure analysis, thin film thickness. Metrology is the most flexible, multi-purpose metrology system available. NanoMez software allows various customized program for the specific metrology works. That is the key factor of superiority of series, NanoMez.