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White-Light Interferometer 500
Interferometers
Raditech
Vertical Resolution [Parameter image_01 Specifications; NanoMez Series; original model column 500]: VSI,VEI <0.5nm;VPI <0.1nm
Lateral Resolution [Parameter image_01 Specifications; NanoMez Series; original model column 500; depends on magnification]: 0.05~7.2 μm
Height Repeatability [Parameter Figure _01 Specifications;NanoMez Series;Source Model Column500;@1σ]: ≤0.3%
Based on the most advanced non-contact 3D profilometry technique, WLI(white Light Interferometry) technology, the NanoMez® Series WL3000F precisely analyzes patterns from 1 nm to 10 nm in height to measure nano-unit surface geometry with fast, accurate and high detection power. In particular, we provide you with an excellent custom solution for 3D topography & structure analysis such as WLP process micro CDs.
By using WLI profilometer technology as basic engine, module base sensor such as Confocal, AFM, Stylus, IRW, Triangle and Moire can be easily detached and optimized for measurement objects such as 3D structure analysis, thin film thickness. Metrology is the most flexible, multi-purpose metrology system available.
NanoMez software allows various customized program for the specific metrology works. That is the key factor of superiority of series, NanoMez.
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White-Light Interferometer 1000
Interferometers
Raditech
Vertical Resolution [Parameter image_01 Specifications; NanoMez Series; original model column 1000]: VSI,VEI <0.5nm;VPI <0.1nm
Lateral Resolution [Parameter image_01 Specifications; NanoMez Series; original model column 1000; depends on magnification]: 0.05~7.2 μm
Height Repeatability [Parameter image_01 Specifications; NanoMez Series; original model column 1000; @1σ; Standard Height]: ≤0.1%
Based on the most advanced non-contact 3D profilometry technique, WLI(white Light Interferometry) technology, the NanoMez® Series WL3000F precisely analyzes patterns from 1 nm to 10 nm in height to measure nano-unit surface geometry with fast, accurate and high detection power. In particular, we provide you with an excellent custom solution for 3D topography & structure analysis such as WLP process micro CDs.
By using WLI profilometer technology as basic engine, module base sensor such as Confocal, AFM, Stylus, IRW, Triangle and Moire can be easily detached and optimized for measurement objects such as 3D structure analysis, thin film thickness. Metrology is the most flexible, multi-purpose metrology system available.
NanoMez software allows various customized program for the specific metrology works. That is the key factor of superiority of series, NanoMez.
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White-Light Interferometer 2000
Interferometers
Raditech
Vertical Resolution [Parameter image_01 Specifications; NanoMez Series; original model column 2000]: VSI,VEI <0.5nm;VPI <0.1nm
Lateral Resolution [Parameter image_01 Specifications; NanoMez Series; original model column 2000; depends on magnification]: 0.05~7.2 μm
Height Repeatability [Parameter image_01 Specifications; NanoMez Series; original model column 2000; @1σ; Standard Height]: ≤0.1%
Based on the most advanced non-contact 3D profilometry technique, WLI(white Light Interferometry) technology, the NanoMez® Series WL3000F precisely analyzes patterns from 1 nm to 10 nm in height to measure nano-unit surface geometry with fast, accurate and high detection power. In particular, we provide you with an excellent custom solution for 3D topography & structure analysis such as WLP process micro CDs.
By using WLI profilometer technology as basic engine, module base sensor such as Confocal, AFM, Stylus, IRW, Triangle and Moire can be easily detached and optimized for measurement objects such as 3D structure analysis, thin film thickness. Metrology is the most flexible, multi-purpose metrology system available.
NanoMez software allows various customized program for the specific metrology works. That is the key factor of superiority of series, NanoMez.
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White-Light Interferometer 3000
Interferometers
Raditech
Vertical Resolution [Parameter image_01 Specifications; NanoMez Series; original model column 3000]: VSI,VEI <0.5nm;VPI <0.1nm
Lateral Resolution [Parameter image_01 Specifications; NanoMez Series; original model column 3000; depends on magnification]: 0.05~7.2 μm
Height Repeatability [Parameter image_01 Specifications; NanoMez Series; original model column 3000; @1σ; Standard Height]: ≤0.1%
Based on the most advanced non-contact 3D profilometry technique, WLI(white Light Interferometry) technology, the NanoMez® Series WL3000F precisely analyzes patterns from 1 nm to 10 nm in height to measure nano-unit surface geometry with fast, accurate and high detection power. In particular, we provide you with an excellent custom solution for 3D topography & structure analysis such as WLP process micro CDs.
By using WLI profilometer technology as basic engine, module base sensor such as Confocal, AFM, Stylus, IRW, Triangle and Moire can be easily detached and optimized for measurement objects such as 3D structure analysis, thin film thickness. Metrology is the most flexible, multi-purpose metrology system available.
NanoMez software allows various customized program for the specific metrology works. That is the key factor of superiority of series, NanoMez.