Infrared Picosecond Dual-Platform Laser Glass Cutting Equipment
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Specifications
| Parameter | Value |
|---|---|
| Laser Type | Infrared Picosecond |
| Platform Dimensions [Customizable] | 700*1200(mm); 500*800(mm), Customizable |
| Cutting Thickness | 0.03-20 mm |
| Cutting Speed | 0-1000 mm/s |
| Cut Edge Chipping | <0.01 mm |
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