Infrared Picosecond Single-Platform Laser Glass Cutting Equipment

Infrared Picosecond Single-Platform Laser Glass Cutting Equipment

Supplier
Glopto
Category
Laser Processing Equipment
Origin
China
Specification Snapshot
Laser Type
Infrared Picosecond
Platform Dimensions [Customizable]
500*600(mm), Customizable
Cutting Thickness
0.03-20 mm
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Specifications

ParameterValue
Laser TypeInfrared Picosecond
Platform Dimensions [Customizable]500*600(mm), Customizable
Cutting Thickness0.03-20 mm
Cutting Speed0-1000 mm/s
Cut Edge Chipping<0.01 mm

Applications

Suitable for Cutting and Shaping Various Brittle, Hard Materials, Including Ordinary Glass, Optical Glass, Quartz, Sapphire, Strengthened Glass, Filters and Mirrors; Internal Holes Can Also Be Cut for Certain Dimensions

Key Features

High-Speed Processing of Irregular Workpieces;Taper-Free Cut Edges,Minimal Chipping,No Hand Injury;Seamless Production Switching Between Specifications,Easy Operation/Learning;Low Running Costs,High Yield,No Consumables/Pollution;No Slag,Waste Liquid or Wastewater,No Surface Scratching

Datasheet

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Supplier Information

Gl
Glopto
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Henan Guluo Optoelectronics Technology Co., Ltd. is a leader in laser equipment, focusing on the R&D, production and sales of ultrafast laser micro-machining equipment. With a 20,000 square meter intelligent manufacturing base, the company masters core technologies such as picosecond and femtosecond lasers, and serves semiconductor, new electronics and new energy industries. It provides precision processing solutions for brittle materials like glass and sapphire, and offers laser cutting, drilling, marking and other customized services with a full production chain from sheet metal to assembly.

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Infrared Picosecond Single-Platform Laser Glass Cutting Equipment
Glopto · Laser Processing Equipment
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