4-Inch Wafer
Glass wafers are generally classified as substrate wafers, carrier wafers, and base wafers. They are core foundational materials in multiple high-technology fields, serving as ideal AR/MR waveguide substrates, carrier wafers in semiconductor manufacturing, and wafer-level optical elements such as microlens arrays and diffractive optics for miniature, integrated optical systems. Automotive projection and display applications include vehicle logo projection and HUD optics, meeting automotive reliability and precision requirements. They also serve as wafers for further processing, including carriers for semiconductor packaging and advanced packaging with TGV through-holes. They are widely used in AR/MR, optical communication, semiconductors, advanced packaging, and automotive applications.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Material [Separate Parameter Image for 4-Inch Wafer] | corning7056 |
| Dimensions [Separate Parameter Image for 4-Inch Wafer; Source Heading] | 4 inch |
| BOW [Separate Parameter Image for 4-Inch Wafer] | ≤10 um |
| TTV [Separate Parameter Image for 4-Inch Wafer] | ≤5 um |
| Chamfer [Separate Parameter Image for 4-Inch Wafer; @45°] | 0.03–0.15 mm |
| Edge Chipping [Separate Parameter Image for 4-Inch Wafer] | <0.15 mm |
| Surface Quality - Scratch Width [Separate Parameter Image for 4-Inch Wafer] | <20 um |
| Surface Quality - Scratch Length [Separate Parameter Image for 4-Inch Wafer] | <2 mm |
| Surface Quality - Number of Scratches [Separate Parameter Image for 4-Inch Wafer] | ≤3 count |
| Surface Treatment [Separate Parameter Image for 4-Inch Wafer] | Polishing Marks and Bluish Color Not Permitted |
Key Features
Datasheet
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Supplier Information
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