Transparent ceramic wafer
Transparent ceramic wafers.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Diameter [Product Specifications] | Ø4~12 |
| Thickness [Product Specifications] | ≥0.3 mm |
| Young's Modulus [Typical Properties] | 300 GPa |
| Dielectric Constant [Typical Properties; 24~77GHz] | 8.75 |
| Poisson’s Ratio [Typical Properties] | 0.26 |
| Dielectric loss [Typical Properties; 24~77GHz] | 2.90 ×10⁻⁴ |
| Flexural strength [Typical Properties] | 460 MPa |
| Dielectric strength [Typical Properties] | 66.32 kV/mm |
| Fracture toughness [Typical Properties] | 2.56 MPa·m^(1/2) |
| Volume Resistivity [Typical Properties] | 1.62 ×10¹⁵Ω·cm |
| Vickers hardness [Typical Properties] | 16.05 GPa |
| TTV [Typical Properties] | <5 μm |
| Specific Heat Capacity [Typical Properties; 25°C] | 0.95 J/(g·°C) |
| WARP [Typical Properties] | <30 μm |
| Thermal Conductivity [Typical Properties; 25°C] | 15.80 W/(m·K) |
| Surface Sa S_a [Typical Properties] | <1 nm |
| Coefficient of Thermal Expansion [Typical Properties; 25~500°C] | 7.36 ×10⁻⁶K⁻¹ |
Applications
Key Features
Datasheet
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Supplier Information
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