12-Inch Wafer
Glass wafers are generally classified as substrate wafers, carrier wafers, and base wafers. They are core foundational materials in multiple high-technology fields, serving as ideal AR/MR waveguide substrates, carrier wafers in semiconductor manufacturing, and wafer-level optical elements such as microlens arrays and diffractive optics for miniature, integrated optical systems. Automotive projection and display applications include vehicle logo projection and HUD optics, meeting automotive reliability and precision requirements. They also serve as wafers for further processing, including carriers for semiconductor packaging and advanced packaging with TGV through-holes. They are widely used in AR/MR, optical communication, semiconductors, advanced packaging, and automotive applications.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Material [Separate Specification Table for 12-Inch Wafer] | Fused Silica/D263T/BF33/EXG/AF32 and Other Custom Options |
| Dimensions [Separate Specification Table for 12-Inch Wafer] | 12 inch |
| Warp [Separate Specification Table for 12-Inch Wafer] | ≤100 um |
| Edge Chipping [Separate Specification Table for 12-Inch Wafer] | ≤0.5 mm |
| Internal Cracks [Separate Specification Table for 12-Inch Wafer] | Not Permitted |
| Surface Treatment [Separate Specification Table for 12-Inch Wafer] | Large Face: Polished or Cut Surface |
Key Features
Datasheet
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Supplier Information
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