Glass wafer
Glass wafers serve displays, semiconductor and IC packaging, biotechnology, sensors, and MEMS packaging. Display substrates support LCD, OLED, and other technologies; cut wafers form AR waveguide lenses. Quartz wafers in semiconductor and optical applications produce subwavelength pigment filters for visible light. IC packaging uses glass substrates for performance and cost effectiveness. In biotechnology and sensing, borosilicate is a high-quality medical glass for equipment such as X-ray systems. Wafers also support integrated biochips and thermoresponsive surfaces for nonenzymatic cell harvesting. In MEMS packaging, screen printing or laser marking creates windows in glass for anodic bonding to silicon and hermetic packages. Glass wafers also provide hermetically sealed electrical connections in MEMS devices.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Dimensions [Diameter Tolerance ±0.05mm] | 12 Inches/8 Inches/6 Inches/4 Inches/3 Inches/2 Inches |
| Thickness [Thickness Tolerance ±0.002mm] | 2mm/1.5mm/1.3mm/1mm/0.7mm/0.5mm/Custom |
| Parallelism | 10” |
| Thickness Uniformity (TTV) [25pcs] | <2μm@25pcs |
| Warp | <20μm |
| Surface Flatness [632.8mm] | PV：RMS≤1/15λ@632.8mm |
| Coating | Uncoated |
| Packaging | Tray Packaging or Clean Cassette Packaging |
| Material | Quartz/K9/B270/BF33/Corning Gorilla Glass, etc. |
Applications
Key Features
Datasheet
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Supplier Information
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