Glass Wafer

Glass Wafer

Supplier
Cnhll
Category
Ceramic and Glass Components
Origin
China

Due to its good transparency, low fluorescence intensity, minimal expansion coefficient, strong resistance to thermal shock, positive chemical stability, scratch resistance, and low alkali content, glass wafers are widely used in high-tech products such as CMOS, CCD sensors, integrated circuits (ICs) or microelectromechanical system (MEMS) packaging, communication and data processing, optics, electronic products and scientific research. Our company specializes in the long-term production of high-precision glass wafers with a thickness of ≥0.1mm and outer dimensions of ≥Φ2". In addition to the conventional Φ4-inch, Φ5-inch, Φ6-inch, Φ8-inch, and Φ12-inch sizes, we also offer customized services for other sizes. Glass wafers are typically made of materials such as Sodalime, Pyrex, Borofloat, Borosilicate (D263T), Corning E-XG, BK7, etc. For custom glass wafers made of other materials, please contact our sales. In the electronics industry, glass wafers are used as substrates for manufacturing integrated circuits (ICs) microelectromechanical systems (MEMS), and other semiconductor devices. The glass provides a stable and inert surface for thin film deposition and circuit patterning. Additionally, glass wafers exhibit positive thermal performance, enabling efficient heat dissipation during device operation. As electronic device dimensions shrink and complexity increases, the demand for high-quality glass wafers with uniform thickness and low defect density becomes increasingly critical. Optical applications also greatly benefit from glass wafers, particularly in the manufacturing of lenses, mirrors, and filters. The optical transparency and homogeneity of glass make it an ideal material for precision optical components used in cameras, telescopes, and laser systems. By carefully controlling the composition and thickness of glass wafers, manufacturers can customize their optical properties to meet specific requirements for light transmission, dispersion, and polarization.

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Overview

Due to its good transparency, low fluorescence intensity, minimal expansion coefficient, strong resistance to thermal shock, positive chemical stability, scratch resistance, and low alkali content, glass wafers are widely used in high-tech products such as CMOS, CCD sensors, integrated circuits (ICs) or microelectromechanical system (MEMS) packaging, communication and data processing, optics, electronic products and scientific research. Our company specializes in the long-term production of high-precision glass wafers with a thickness of ≥0.1mm and outer dimensions of ≥Φ2". In addition to the conventional Φ4-inch, Φ5-inch, Φ6-inch, Φ8-inch, and Φ12-inch sizes, we also offer customized services for other sizes. Glass wafers are typically made of materials such as Sodalime, Pyrex, Borofloat, Borosilicate (D263T), Corning E-XG, BK7, etc. For custom glass wafers made of other materials, please contact our sales. In the electronics industry, glass wafers are used as substrates for manufacturing integrated circuits (ICs) microelectromechanical systems (MEMS), and other semiconductor devices. The glass provides a stable and inert surface for thin film deposition and circuit patterning. Additionally, glass wafers exhibit positive thermal performance, enabling efficient heat dissipation during device operation. As electronic device dimensions shrink and complexity increases, the demand for high-quality glass wafers with uniform thickness and low defect density becomes increasingly critical. Optical applications also greatly benefit from glass wafers, particularly in the manufacturing of lenses, mirrors, and filters. The optical transparency and homogeneity of glass make it an ideal material for precision optical components used in cameras, telescopes, and laser systems. By carefully controlling the composition and thickness of glass wafers, manufacturers can customize their optical properties to meet specific requirements for light transmission, dispersion, and polarization.

Specifications

ParameterValue
Diameter [4 inch;± 0.1 mm]100 ± 0.1 mm
Diameter [5 inch;± 0.1 mm]125 ± 0.1 mm
Diameter [6 inch;± 0.1 mm]150 ± 0.1 mm
Diameter [8 inch;± 0.1 mm]200 ± 0.1 mm
Diameter [12 inch;± 0.1 mm]300± 0.1 mm
Thickness [4 inch;± 5 um;or customized]500 ± 5 um or customized
Thickness [5 inch;± 5 um;or customized]625 ± 5 um or customized
Thickness [6 inch;± 5 um;or customized]675 ± 5 um or customized
Thickness [8 inch;± 5 um;or customized]725 ± 5 um or customized
Thickness [12 inch;± 5 um;or customized]900± 5 um or customized
Roughness Ra [4 inch]Ra ≤ 1 nm
Roughness Ra [5 inch]Ra ≤ 1 nm
Roughness Ra [6 inch]Ra ≤ 1 nm
Roughness Ra [8 inch]Ra ≤ 1 nm
Roughness Ra [12 inch]Ra ≤ 1 nm
Warpage [4 inch]≤ 10um
Warpage [5 inch]≤ 10um
Warpage [6 inch]≤ 10um
Warpage [8 inch]≤ 10um
Warpage [12 inch]≤ 10um
Flatness [4 inch]≤ 3 um
Flatness [5 inch]≤ 3 um
Flatness [6 inch]≤ 3 um
Flatness [8 inch]≤ 3 um
Flatness [12 inch]≤ 3 um
Surface [4 inch]20/10
Surface [5 inch]20/10
Surface [6 inch]20/10
Surface [8 inch]20/10
Surface [12 inch]20/10
Shape [4 inch]Round, with locating edges, with locating angles
Shape [5 inch]Round, with locating edges, with locating angles
Shape [6 inch]Round, with locating edges, with locating angles
Shape [8 inch]Round, with locating edges, with locating angles
Shape [12 inch]Round, with locating edges, with locating angles
Inverted edges [4 inch]45°, SEMI Spec; C Shape
Inverted edges [5 inch]45°, SEMI Spec; C Shape
Inverted edges [6 inch]45°, SEMI Spec; C Shape
Inverted edges [8 inch]45°, SEMI Spec; C Shape
Inverted edges [12 inch]45°, SEMI Spec; C Shape
Material [4 inch]Sodalime, Pyrex, Borofloat, Borosilicate (D263T), Corning eagle XG, BK7, and etc.
Material [5 inch]Sodalime, Pyrex, Borofloat, Borosilicate (D263T), Corning eagle XG, BK7, and etc.
Material [6 inch]Sodalime, Pyrex, Borofloat, Borosilicate (D263T), Corning eagle XG, BK7, and etc.
Material [8 inch]Sodalime, Pyrex, Borofloat, Borosilicate (D263T), Corning eagle XG, BK7, and etc.
Material [12 inch]Sodalime, Pyrex, Borofloat, Borosilicate (D263T), Corning eagle XG, BK7, and etc.

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Supplier Information

Founded in 1998, HLL is located in the national-level High-tech Development District, Changzhou, Jiangsu, China. It’s neighboring Shanghai-Nanjing Expressway on the north, Changzhou high-speed railway station on the east, Changzhou Airport on the west. HLL covers an area of 35,000m² and has passed the system certification such as ISO9001:2015, ISO14001:2015, and IATF16949. As a High-Tech enterprise in Jiangsu province, HLL boasts a talented team with intensive experience and professional technology. HLL has established Jiangsu Precision Optical Lens Engineering Technology Center and Jiangsu Enterprise Technology Research Center and obtained multiple patents for inventions, multiple utility model patents and multiple Jiangsu High New Tech Products. HLL mainly develops and produces various precision optical components. Focus on laser optics, auto optics, the semiconductor industry and consumer optics. HLL will strive to become a benchmark in China's optical industry.

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