CSL Celcom series RF power supplies
An RF supply generates high-frequency alternating current to excite and control plasma. Power amplification and impedance matching efficiently transfer energy to a dynamically changing plasma load. A core high-end manufacturing device, it powers precision semiconductor etching, thin-film deposition, plasma cleaning, and related processes as an essential energy source in modern electronics.
Specification Snapshot
Dimensions [Configuration in this row: Operating frequency 13.56MHz; Power 100W 300W 1000W 1200W; Options within the same power cell share this row's cooling/dimensions, not independent models]
88.2mm (height) 483mm (width) 504mm (depth)
Dimensions [Configuration in this row: Operating frequency 13.56MHz; Power 2000W 2500W 3000W; Options within the same power cell share this row's cooling/dimensions, not independent models]
132mm (height) 483 (width) 555.5mm (depth)
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Overview
An RF supply generates high-frequency alternating current to excite and control plasma. Power amplification and impedance matching efficiently transfer energy to a dynamically changing plasma load. A core high-end manufacturing device, it powers precision semiconductor etching, thin-film deposition, plasma cleaning, and related processes as an essential energy source in modern electronics.
Specifications
| Parameter | Value |
|---|---|
| Operating Frequency [Configuration in this row: Operating frequency 13.56MHz; Power 100W 300W 1000W 1200W; Options within the same power cell share this row's cooling/dimensions, not independent models] | 13.56 MHz |
| Power [Configuration in this row: Operating frequency 13.56MHz; Power 100W 300W 1000W 1200W; Options within the same power cell share this row's cooling/dimensions, not independent models] | 100/300/1000/1200 |
| Cooling Method [Configuration in this row: Operating frequency 13.56MHz; Power 100W 300W 1000W 1200W; Options within the same power cell share this row's cooling/dimensions, not independent models] | Air Cooling |
| Dimensions [Configuration in this row: Operating frequency 13.56MHz; Power 100W 300W 1000W 1200W; Options within the same power cell share this row's cooling/dimensions, not independent models] | 88.2mm (height) 483mm (width) 504mm (depth) |
| Communication Interface [Configuration in this row: Operating frequency 13.56MHz; Power 100W 300W 1000W 1200W; Options within the same power cell share this row's cooling/dimensions, not independent models] | Analog; RS232/485 |
| Communication Interface (Optional) [Configuration in this row: Operating frequency 13.56MHz; Power 100W 300W 1000W 1200W; Options within the same power cell share this row's cooling/dimensions, not independent models] | PROFIBUS |
| Operating Frequency [Configuration in this row: Operating frequency 13.56MHz; Power 2000W 2500W 3000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | 13.56 MHz |
| Power [Configuration in this row: Operating frequency 13.56MHz; Power 2000W 2500W 3000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | 2000/2500/3000 |
| Cooling Method [Configuration in this row: Operating frequency 13.56MHz; Power 2000W 2500W 3000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | Air Cooling+Water Cooling |
| Dimensions [Configuration in this row: Operating frequency 13.56MHz; Power 2000W 2500W 3000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | 132mm (height) 483 (width) 555.5mm (depth) |
| Communication Interface [Configuration in this row: Operating frequency 13.56MHz; Power 2000W 2500W 3000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | Analog; RS232/485 |
| Communication Interface (Optional) [Configuration in this row: Operating frequency 13.56MHz; Power 2000W 2500W 3000W; Options within the same power cell share this row's cooling/dimensions, not independent models] | PROFIBUS |
Applications
Photovoltaics and flat-panel displays; MEMS etching, chemical vapor deposition, and physical vapor deposition.
Key Features
An active front panel with live power and impedance measurements simplifies monitoring and setup. Operation with 12 CELCOM supplies: Allows 12 units to operate at the same frequency and phase into one plasma.
Datasheet
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Supplier Information
Shenzhen CSL Vacuum Technology Co., Ltd. is a leading domestic supplier of core components for large-scale integrated circuit wafer front-end thin film deposition, plasma etching, lithography, photoresist stripping, ion implantation, and bonding equipment. The company is mainly engaged in the R&D, production, sales, and technical services of plasma RF power supply systems, plasma excitation devices, plasma DC power supplies, and various accessories. It also introduces core components related to vacuum acquisition and fluid control, providing overall solutions for core components around plasma processes.
The company is a domestically technologically leading enterprise in plasma RF power supply systems that has achieved mass product delivery. Its products have been delivered in batches to leading domestic equipment manufacturers such as Piotech, AMEC, NAURA, Leadmicro, and ACM Research, and are also supplied to leading domestic wafer fabs.
Founded in March 2013 and headquartered in Bao'an District, Shenzhen, the company has obtained ISO9001 and ISO14001 certifications. It is a national key "Little Giant" enterprise with specialized and sophisticated technologies, a national "Little Giant" enterprise, a council member of the China Integrated Circuit Component Innovation Alliance, a national high-tech enterprise, a "Kechuang China" RF switching power supply innovation base, a 2024 Guangdong Province Manufacturing Single Champion, and a Guangdong Province RF Switching Power Supply Engineering Technology Research Center. It has also won the 6th China Integrated Circuit Innovation Alliance "IC Innovation Award", the first prize of Guangdong Province Vacuum Science and Technology Progress Award, the "Core Component Innovation Award" of the 2024 "Bay Chip Award", SMIC's "Component Module Strategic Supplier", Piotech's "Outstanding Partner Award" and "Best Delivery Award", and Leadmicro's "Best Cooperation Award", among other honors.
The company will continue to be committed to the R&D and production of core components for semiconductor equipment, providing customers with comprehensive integrated solutions, fulfilling social responsibilities, deeply cultivating the industry, demonstrating responsibility, and contributing to the high-quality development of the national integrated circuit equipment industry.
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