1860DPC ceramic substrate

1860DPC ceramic substrate

Supplier
Jxibt
Category
Ceramic and Glass Components
Origin
China

DPC, or direct-plated-copper substrate, begins with laser drilling and scribing of ceramic substrates according to product and design requirements. After cleaning, vacuum coating deposits copper. Yellow-light photolithography or laser development forms the circuitry, and electroplating/electroless deposition increases its thickness to complete metallized circuits.

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Overview

DPC, or direct-plated-copper substrate, begins with laser drilling and scribing of ceramic substrates according to product and design requirements. After cleaning, vacuum coating deposits copper. Yellow-light photolithography or laser development forms the circuitry, and electroplating/electroless deposition increases its thickness to complete metallized circuits.

Key Features

Compared with traditional LTCC, HTCC, DBC, and other thick-film processes, DPC offers: 1. Higher thermal conductivity: Vacuum and plating processes avoid glass added during sintering and preserve the intrinsic conductivity of ceramic and copper. DPC generally preserves alumina conductivity of around 25. 2. No material deformation: Avoiding high-temperature production prevents thermal deformation and shrinkage. 3. Stable processing: Vacuum and plating replace conventional high-temperature furnaces, with controllable parameters, small deviations, and consistent quality. 4. Controllable metal thickness: Unlike sintering constrained by copper-foil thickness, DPC provides 1-100 micrometers and allows advance design for required thickness and circuit resolution across applications. 5. Highest circuit resolution: Thick-film printing and sintering produce relatively coarse LTCC/HTCC circuits suited to low-power, low-requirement, inexpensive applications. Even DBC is limited to 150-300 micrometers. Grinding copper thinner can cause poor flatness affecting light efficiency and die attachment while increasing costs. DPC provides smooth, flat surfaces and clear circuits, particularly suitable for fujing (source term) or eutectic bonding.

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Supplier Information

Jiangxi Haoguang Technology Co., Ltd. is an enterprise specializing in the research, development, production, and sales of ceramic circuit substrates and chip carriers. The company is located in Xinfeng County, southern Ganzhou City, Jiangxi Province, at the forefront of integration into the Guangdong-Hong Kong-Macao Greater Bay Area. The unique policies and conditions provide excellent development opportunities and fertile ground. After 20 years of development and accumulation in Shenzhen, the enterprise moved to Xinfeng County, Ganzhou City, Jiangxi Province, and has achieved full-process manufacturing within the factory. The company has 1 overseas specially appointed expert, 3 domestic technical experts, and more than 20 professional technicians, and maintains long-term cooperation with universities and research institutions, with strong R&D strength and advanced technology development. Jiangxi Haoguang Technology Industrial Park covers an area of 68 mu, with a construction area of more than 60,000 square meters. It is a modern factory integrating processes, equipment, production, intelligent management, operation and maintenance, and R&D and manufacturing. It has production workshops, R&D buildings, office buildings, staff dormitories, etc., and supporting facilities include power, fire protection, industrial wastewater and waste gas environmental treatment and auxiliary facilities. We always adhere to serving customers with heart, adhering to the business philosophy of "ensuring first-class quality, maintaining first-class reputation", insisting on quality first, and providing customers with high-quality high-tech products. The company's products are mainly DPC ceramic substrates, UDBC ceramic substrates, metallized ceramic substrates, EMC substrates, etc. Integrating laser micromachining, vacuum coating technology, electroplating/electroless plating technology, yellow light development technology, etc., the company focuses on the application of ceramic substrates in LED, semiconductor, automotive electronics, microwave communication, power modules, chemical textile and other fields, and has successfully launched DPC ceramic brackets, COB ceramic substrates, metallized ceramic substrates, ceramic circuits, etc. Good products and favorable prices have promoted the development and progress of the domestic LED application market.

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1860DPC ceramic substrate
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