Dual Station Picosecond Laser Depaneling Cutting Machine

Dual Station Picosecond Laser Depaneling Cutting Machine

Supplier
Yinhulaser
Part Number
YH-CL-03
Category
Laser Modules & Systems
Origin
China

The device uses a dual platform Laser Cutting system , Optional Choice Picosecond Ultraviolet / Picosecond The green light is different. Laser , Set up cutting preview , Best solution for clients 。

Specification Snapshot
Laser Wavelength
355nm/532nm/1064nm( Natron / Picosecond )
Laser Power
15W-100W( Select type according to demand )
Positioning Accuracy
±2μm
Repeatability
±2μm
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Overview

The device uses a dual platform Laser Cutting system , Optional Choice Picosecond Ultraviolet / Picosecond The green light is different. Laser , Set up cutting preview , Best solution for clients 。

Specifications

ParameterValue
Size of equipment1500 mm × 1500 mm × 1700 mm
Equipment Weight1800KG
Equipment distributionHost AC220V ,50~60Hz/3kW Dust cleaners AC380V ,50~60Hz/2.2kW
Use EnvironmentCleaning plant , 23±3℃, The relative humidity must be maintained at 20-80% Internal
Laser Wavelength355nm/532nm/1064nm( Natron / Picosecond )
Laser Power15W-100W( Select type according to demand )
Laser Repetition Rate50-350kHz/200-1000kHz
Processed Band300mm × 400mm × 2( Double platform Customizable )
Process precision±20μm
XYZ Maximum Run speedX:800mm / Y:800mm / Z:50mm/s
XYZ Maximum TravelX:700mm / Y:400mm / Z:25mm
Positioning Accuracy±2μm
Repeatability±2μm
Lightmark Size25μm
Laser Scan Range50 mm × 50 mm

Applications

FPC Exterior Cut , Camera Module ,PCB Split , The hard-cut panel opens the window.

Key Features

Working modalities of the two platforms , Process efficiency Different. Laser Address customer needs for different processes Cuts are good. , None - Pumps. , It's a low heat. Industrialization design ,7*24 Maintain processing accuracy and operational stability under operating conditions

Datasheet

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Supplier Information

Yi
Yinhulaser
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Hangzhou Yinhu Laser Technology Co., Ltd. is a high-tech enterprise founded by national leading talents. The company focuses on the R&D, production and sales of laser micro-nano manufacturing equipment for chip packaging materials. Its products cover high-speed computing chip packaging and high-power chip packaging materials, with specific processing materials including glass, ceramics, sapphire, diamond, gallium oxide, etc. The company's R&D team is led by international professional academicians and has research talents including doctors, masters and bachelors from home and abroad. Relying on multiple laser manufacturing research platforms such as the Provincial and Ministerial Co-construction Collaborative Innovation Center for High-end Laser Manufacturing Equipment and the Zhejiang Yinhu Laser Micro-nano Processing Equipment Enterprise High-tech Research and Development Center, the company has established cooperative relations with universities and institutes such as Zhejiang University of Technology, Shanghai Institute of Optics and Fine Mechanics and Xi'an Institute of Optics and Precision Mechanics of CAS. The company has won honors such as National High-tech Enterprise, Zhejiang Provincial Enterprise High-tech R&D Center, Hangzhou Leading Innovation Team, Zhejiang Provincial Specialized, Refined, Distinctive and Innovative SME, and Zhejiang Provincial Innovative SME. The company's self-developed ultrafast laser transparent material processing equipment has served many leading enterprises in China. Yinhu Laser has always adhered to the development philosophy of "Professional, Innovative, Win-win", always serving every customer with professional technology and providing customers with satisfactory laser manufacturing solutions.

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Dual Station Picosecond Laser Depaneling Cutting Machine
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