Dual Station Picosecond Laser Depaneling Cutting Machine
The device uses a dual platform Laser Cutting system , Optional Choice Picosecond Ultraviolet / Picosecond The green light is different. Laser , Set up cutting preview , Best solution for clients 。
Specification Snapshot
Laser Wavelength
355nm/532nm/1064nm( Natron / Picosecond )
Laser Power
15W-100W( Select type according to demand )
Positioning Accuracy
±2μm
Repeatability
±2μm
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Overview
The device uses a dual platform Laser Cutting system , Optional Choice Picosecond Ultraviolet / Picosecond The green light is different. Laser , Set up cutting preview , Best solution for clients 。
Specifications
| Parameter | Value |
|---|---|
| Size of equipment | 1500 mm × 1500 mm × 1700 mm |
| Equipment Weight | 1800KG |
| Equipment distribution | Host AC220V ,50~60Hz/3kW Dust cleaners AC380V ,50~60Hz/2.2kW |
| Use Environment | Cleaning plant , 23±3℃, The relative humidity must be maintained at 20-80% Internal |
| Laser Wavelength | 355nm/532nm/1064nm( Natron / Picosecond ) |
| Laser Power | 15W-100W( Select type according to demand ) |
| Laser Repetition Rate | 50-350kHz/200-1000kHz |
| Processed Band | 300mm × 400mm × 2( Double platform Customizable ) |
| Process precision | ±20μm |
| XYZ Maximum Run speed | X:800mm / Y:800mm / Z:50mm/s |
| XYZ Maximum Travel | X:700mm / Y:400mm / Z:25mm |
| Positioning Accuracy | ±2μm |
| Repeatability | ±2μm |
| Lightmark Size | 25μm |
| Laser Scan Range | 50 mm × 50 mm |
Applications
FPC Exterior Cut , Camera Module ,PCB Split , The hard-cut panel opens the window.
Key Features
Working modalities of the two platforms , Process efficiency Different. Laser Address customer needs for different processes Cuts are good. , None - Pumps. , It's a low heat. Industrialization design ,7*24 Maintain processing accuracy and operational stability under operating conditions
Datasheet
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Supplier Information
Hangzhou Yinhu Laser Technology Co., Ltd. is a high-tech enterprise founded by national leading talents. The company focuses on the R&D, production and sales of laser micro-nano manufacturing equipment for chip packaging materials. Its products cover high-speed computing chip packaging and high-power chip packaging materials, with specific processing materials including glass, ceramics, sapphire, diamond, gallium oxide, etc.
The company's R&D team is led by international professional academicians and has research talents including doctors, masters and bachelors from home and abroad. Relying on multiple laser manufacturing research platforms such as the Provincial and Ministerial Co-construction Collaborative Innovation Center for High-end Laser Manufacturing Equipment and the Zhejiang Yinhu Laser Micro-nano Processing Equipment Enterprise High-tech Research and Development Center, the company has established cooperative relations with universities and institutes such as Zhejiang University of Technology, Shanghai Institute of Optics and Fine Mechanics and Xi'an Institute of Optics and Precision Mechanics of CAS. The company has won honors such as National High-tech Enterprise, Zhejiang Provincial Enterprise High-tech R&D Center, Hangzhou Leading Innovation Team, Zhejiang Provincial Specialized, Refined, Distinctive and Innovative SME, and Zhejiang Provincial Innovative SME. The company's self-developed ultrafast laser transparent material processing equipment has served many leading enterprises in China.
Yinhu Laser has always adhered to the development philosophy of "Professional, Innovative, Win-win", always serving every customer with professional technology and providing customers with satisfactory laser manufacturing solutions.
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