FPC Picosecond Laser Roll to Sheet Cutting Machine
The equipment has a sports platform and a high speed of importation Galvanometer Scanner Scan Head , Configure CCD Positioning Module , High Precision Magnetic suspended line electrics , Fly-cutting mode of walking and cutting , Resolve FPC The sideware. 、 Drilling. 、 Open model. 、 Four critical processes are strung through. , Existing FPC Foreign Laser All the cutting machines. 。
Specification Snapshot
Laser Wavelength
355nm/532nm( Picosecond )
Laser Power
10W 15W 20W 30W 40W( Select type according to demand )
Positioning Accuracy
±2μm
Repeatability
±2μm
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Overview
The equipment has a sports platform and a high speed of importation Galvanometer Scanner Scan Head , Configure CCD Positioning Module , High Precision Magnetic suspended line electrics , Fly-cutting mode of walking and cutting , Resolve FPC The sideware. 、 Drilling. 、 Open model. 、 Four critical processes are strung through. , Existing FPC Foreign Laser All the cutting machines. 。
Specifications
| Parameter | Value |
|---|---|
| Size of equipment | 1500 mm × 1600 mm × 1750 mm |
| Equipment Weight | 2000kg |
| Equipment distribution | Host AC220V 50Hz/5.0KW Windmills, three. 380V 50Hz/3.8KW |
| Use Environment | Cleaning plant , 23±3℃, The relative humidity must be maintained at 20-80% Internal |
| Laser Wavelength | 355nm/532nm( Picosecond ) |
| Laser Power | 10W 15W 20W 30W 40W( Select type according to demand ) |
| Laser Repetition Rate | 50-350kHz/200-1000kHz |
| Processed Band | 280mm × 500mm × 2( Double platform Customizable ) |
| Process precision | ±20μm |
| XYZ Maximum Run speed | X:500mm / Y:500mm / Z:50mm/s |
| XYZ Maximum Travel | X:380mm / Y:600mm / Z:25mm |
| CCD Pixels | 500 Thousand |
| Positioning Accuracy | ±2μm |
| Repeatability | ±2μm |
| Lightmark Size | 25μm |
| Laser Scan Range | 50 mm × 50 mm |
Key Features
Double Platform Sync , Double production efficiency Single-Dual Free Switch , Meeting different processing needs of clients Pre-processing preview , Avoiding Clipboard Waste , Savings Material Real cold processing. , Production processing None Carbonization , Green
Datasheet
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Supplier Information
Hangzhou Yinhu Laser Technology Co., Ltd. is a high-tech enterprise founded by national leading talents. The company focuses on the R&D, production and sales of laser micro-nano manufacturing equipment for chip packaging materials. Its products cover high-speed computing chip packaging and high-power chip packaging materials, with specific processing materials including glass, ceramics, sapphire, diamond, gallium oxide, etc.
The company's R&D team is led by international professional academicians and has research talents including doctors, masters and bachelors from home and abroad. Relying on multiple laser manufacturing research platforms such as the Provincial and Ministerial Co-construction Collaborative Innovation Center for High-end Laser Manufacturing Equipment and the Zhejiang Yinhu Laser Micro-nano Processing Equipment Enterprise High-tech Research and Development Center, the company has established cooperative relations with universities and institutes such as Zhejiang University of Technology, Shanghai Institute of Optics and Fine Mechanics and Xi'an Institute of Optics and Precision Mechanics of CAS. The company has won honors such as National High-tech Enterprise, Zhejiang Provincial Enterprise High-tech R&D Center, Hangzhou Leading Innovation Team, Zhejiang Provincial Specialized, Refined, Distinctive and Innovative SME, and Zhejiang Provincial Innovative SME. The company's self-developed ultrafast laser transparent material processing equipment has served many leading enterprises in China.
Yinhu Laser has always adhered to the development philosophy of "Professional, Innovative, Win-win", always serving every customer with professional technology and providing customers with satisfactory laser manufacturing solutions.
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