Post Dicing
During semiconductor manufacturing, the crystal-circle process may cause the edge of the chip to collapse or the chip to break, which will seriously affect the performance and reliability of the chip. Therefore, after the crystal-clip amplification, the edge test must be performed to ensure that each chip meets quality standards. Solutions: The Vipp Tornado series of defects detection equipment, based on the detection techniques of the dark field, can be used to detect the edges of the blades, and the fractures of the blades that are found to be cut. Automatic correction is made for the diaphragm angle and position deviation that is generated after the amplification. Application effects: The edge of the drop can be accurately detected. The size of the drop can be specified in the program.
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