TGV glass panel
The glass-grow-Glass Via, TGV interconnectivity technique is derived from 2.5D/3D integrated TSV trans-board technology, which is used primarily to address the degradation of high frequency or high-speed signal transmission properties, high material costs and process complexity of TSV because of silicate line loss. In the TGV process, the main steps are opening holes, filling metals, making lines, etc., for which the corresponding defects are tested to ensure the end product’s goodness. Application effects: leaking holes; diameter limits; ids exceeding limits; metal filling; normal filling; line differences; line break-off
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