Panel CMP TPP-5120
The board is manually placed on the upper and lower feed table, the board is placed on the upper and lower feed table and is then automatically polished, the platform is equipped with a friction endpoint test, and automatically polishes to the target value before it ceases.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Wafer Size | 515*510mm / 600*600mm |
| Number of heads polished | 1 units |
| Spraying the head diameter | OD930 mm |
| Disk diameter | OD1300 mm |
Key Features
Datasheet
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Supplier Information
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