Filamentation Cutting Modules ZT Module-001-I/J

Filamentation Cutting Modules ZT Module-001-I/J

Supplier
Sinteclaser
Part Number
ZT Module-001-I/J
Category
Diffractive Optics
Origin
China

The filament cutting module is a diffractive optical assembly for glass filament cutting. It shapes the incident laser waist to only 1.8um throughout the depth of focus, with focus size corresponding to 0.35 of the objective aperture stop. Uniform axial energy over a 1mm-long spot in air suits thick-glass cutting. Its very small spot, high uniformity, and 93% energy utilization support glass thicknesses of 0~2.5mm. Compared with multifocus and extended-depth techniques, spot size and uniformity improve substantially. Compared with an axicon-generated Bessel beam, greater uniformity provides better cut-surface quality and lower kerf roughness. Conventional diamond scribing creates surface microgrooves before external force separates the glass, but newer display-driven glass requires greater cutting precision. Laser cutting is controllable, noncontact, and low-contamination, with clean edges, good perpendicularity, and little internal damage at high speed. Common brittle-material cutting wavelengths are 1064nm and 1030nm. Filament cutting typically uses 1064nm or 1030nm ultrashort-pulse (USP) lasers for substrates including soft borosilicate and tempered smartphone-display glass. It forms an axially uniform laser-filament blade, offering good edges at speeds up to 2000 millimeters/second without postprocessing. The source's simulation compares its axial energy distribution with a standard Bessel spot in red: energy is concentrated in the cutting region, while ordinary Bessel beams have nonuniform, excessively long focal depths with unusable below-threshold energy. Simulated in-air distribution produces a uniform line around 1mm deep, with the right-hand Z-axis profile showing greater uniformity than extended-depth, multifocus, and ordinary axicon Bessel optics. Model catalog: Model | ZT Module-001-I/J | ZT Module-004-I/J | ZT Module-005-I/J | ZT Module-006-I/J Wavelength | 1030nm, 1064nm, Other wavelengths on request | 1030nm, 1064nm, Other wavelengths on request | 1030nm, 1064nm, Other wavelengths on request | 1030nm, 1064nm, Other wavelengths on request Required laser input | Single mode M2<1.3 | Single mode M2<1.3 | Single mode M2<1.3 | Single mode M2<1.3 Input beam diameter | 6mm (+-10% ) | 6mm (+-10% ) | 6mm (+-10% ) | 6mm (+-10% ) Depth of focus in air | ~1mm | ~0.5mm | ~0.75mm | ~1.5mm Beam waist diameter | 1.8um | 1.8um | 1.8um | 1.8um Working distance | 7.4mm | 7.4mm | 7.4mm | 7.4mm Dimensions | Diameter 30.5mm*,Length 106mm | Diameter 30.5mm*,Length 106mm | Diameter 30.5mm*,Length 106mm | Diameter 30.5mm*,Length 106mm Mounting thread | Outside diameter SM1 and SM05 | Outside diameter SM1 and SM05 | Outside diameter SM1 and SM05 | Outside diameter SM1 and SM05 Optical element material | Fused quartz | Fused quartz | Fused quartz | Fused quartz Efficiency | >93% | >93% | >93% | >91% *Depth of focus customizable to customer requirements。

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Overview

The filament cutting module is a diffractive optical assembly for glass filament cutting. It shapes the incident laser waist to only 1.8um throughout the depth of focus, with focus size corresponding to 0.35 of the objective aperture stop. Uniform axial energy over a 1mm-long spot in air suits thick-glass cutting. Its very small spot, high uniformity, and 93% energy utilization support glass thicknesses of 0~2.5mm. Compared with multifocus and extended-depth techniques, spot size and uniformity improve substantially. Compared with an axicon-generated Bessel beam, greater uniformity provides better cut-surface quality and lower kerf roughness. Conventional diamond scribing creates surface microgrooves before external force separates the glass, but newer display-driven glass requires greater cutting precision. Laser cutting is controllable, noncontact, and low-contamination, with clean edges, good perpendicularity, and little internal damage at high speed. Common brittle-material cutting wavelengths are 1064nm and 1030nm. Filament cutting typically uses 1064nm or 1030nm ultrashort-pulse (USP) lasers for substrates including soft borosilicate and tempered smartphone-display glass. It forms an axially uniform laser-filament blade, offering good edges at speeds up to 2000 millimeters/second without postprocessing. The source's simulation compares its axial energy distribution with a standard Bessel spot in red: energy is concentrated in the cutting region, while ordinary Bessel beams have nonuniform, excessively long focal depths with unusable below-threshold energy. Simulated in-air distribution produces a uniform line around 1mm deep, with the right-hand Z-axis profile showing greater uniformity than extended-depth, multifocus, and ordinary axicon Bessel optics. Model catalog: Model | ZT Module-001-I/J | ZT Module-004-I/J | ZT Module-005-I/J | ZT Module-006-I/J Wavelength | 1030nm, 1064nm, Other wavelengths on request | 1030nm, 1064nm, Other wavelengths on request | 1030nm, 1064nm, Other wavelengths on request | 1030nm, 1064nm, Other wavelengths on request Required laser input | Single mode M2<1.3 | Single mode M2<1.3 | Single mode M2<1.3 | Single mode M2<1.3 Input beam diameter | 6mm (+-10% ) | 6mm (+-10% ) | 6mm (+-10% ) | 6mm (+-10% ) Depth of focus in air | ~1mm | ~0.5mm | ~0.75mm | ~1.5mm Beam waist diameter | 1.8um | 1.8um | 1.8um | 1.8um Working distance | 7.4mm | 7.4mm | 7.4mm | 7.4mm Dimensions | Diameter 30.5mm*,Length 106mm | Diameter 30.5mm*,Length 106mm | Diameter 30.5mm*,Length 106mm | Diameter 30.5mm*,Length 106mm Mounting thread | Outside diameter SM1 and SM05 | Outside diameter SM1 and SM05 | Outside diameter SM1 and SM05 | Outside diameter SM1 and SM05 Optical element material | Fused quartz | Fused quartz | Fused quartz | Fused quartz Efficiency | >93% | >93% | >93% | >91% *Depth of focus customizable to customer requirements。

Key Features

Cuts the full glass depth with a single pulse. A single module provides the complete optical solution. Spot size <2um corresponds to very low aberration. Easily integrated into existing optomechanics. Operating temperature -40℃~150℃.

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Supplier Information

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Sinteclaser
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Wuhan Sintec Optoelectronics Technology Co., Ltd. is a high-tech enterprise and a specialized and sophisticated 'Little Giant' enterprise at the upstream of the domestic laser industry chain. The company focuses on the R&D, manufacturing, sales and service of lasers and laser accessories. Its main products include femtosecond lasers, picosecond lasers, acousto-optic modulators, optical components, etc., widely used in laser equipment manufacturing, scientific research and other fields. Located in Wuhan Optical Valley, with a modern industrial park, the company provides one-stop personalized services for the laser industry, with customers all over China and products exported overseas.

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Filamentation Cutting Modules ZT Module-001-I/J
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