Diamond Heat Sink
Diamond has the highest thermal conductivity of any known natural material. CVD diamond reaches 2200W/mK, 5 times that of copper, making it a heat-dissipation material with exceptionally high thermal conductivity. It efficiently dissipates heat generated by devices; the source describes it as the best thermal-management material for high-heat-flux devices.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Growth Method [Heat-sink grade; polycrystalline] | MPCVD |
| Growth Method [Heat-sink grade; single crystal] | MPCVD |
| Dimensions [Heat-sink grade; polycrystalline] | Ф50-Ф150 |
| Dimensions [Heat-sink grade; single crystal] | ≥10 mm |
| Thermal Conductivity [Heat-sink grade; polycrystalline; 300K] | >1200 W/mK |
| Thermal Conductivity [Heat-sink grade; single crystal; 300K] | >1500 W/mK |
| Coefficient of Thermal Expansion [Heat-sink grade; polycrystalline; 300K] | 1.0 10⁻⁶/K |
| Coefficient of Thermal Expansion [Heat-sink grade; single crystal; 300K] | 1.0 10⁻⁶/K |
| Vickers hardness [Heat-sink grade; polycrystalline] | 80 GPa |
| Vickers hardness [Heat-sink grade; single crystal] | 70-120 GPa |
| Thickness [Heat-sink grade; polycrystalline] | ≥0.2 mm |
| Thickness [Heat-sink grade; single crystal] | ≥0.1 mm |
| Thickness Tolerance [Heat-sink grade; polycrystalline] | ±0.03 mm |
| Thickness Tolerance [Heat-sink grade; single crystal] | ±0.03 mm |
| Roughness Ra [Heat-sink grade; polycrystalline] | ≤30 nm |
| Roughness Ra [Heat-sink grade; single crystal] | ≤30 nm |
Datasheet
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Supplier Information
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