Silicon Nitride Si 3 N 4 Ceramic Substrate
Silicon nitride ceramic is an inorganic material that does not shrink when sintered. It uses silicon powder as a raw material, and first makes the required shape by the usual molding method, and performs preliminary nitriding in nitrogen and at a high temperature of 1200°C, so that part of the silicon powder reacts with nitrogen to form silicon nitride, and then The second nitriding is carried out in a high-temperature furnace at 1350 ° C to 1450 ° C, and the reaction becomes silicon nitride. Silicon nitride with a theoretical density of 99% can be obtained by hot pressing sintering. The thermal conductivity of Si3N4 ceramics at room temperature ranges from 10 to 16 W / mK.
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Overview
Specifications
| Parameter | Value |
|---|---|
| molecular formula | Si 3 N 4 |
| relative molecular mass | 140.28 |
| color | gray, gray black |
| crystal system | Hexagonal crystal system , the crystal is hexahedral |
| Preparation method of ceramic sheet | hot pressing |
| Relative density | 99.5% |
| density | 3.2+/-0.02 g/ cm3 |
| Moh's hardness | 9~9.5 |
| melting point | 1900°C (under pressure). Usually decomposes at 1900°C under normal pressure |
| Thermal expansion coefficient [20~1000℃] | 2.8~3.2×10-6/℃(20~1000℃) |
| specific heat capacity | 0.71J/g·K |
| Thermal conductivity | 15~20W / m·K |
| Elastic Modulus | 300~320GPa |
| Fracture toughness | 6.0~7.0 MPa.m |
| Bending strength | 650~750 MPa |
| Weber modulus | 10~12 |
| Solubility | Insoluble in water. Soluble in hydrofluoric acid. |
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Key Features
Datasheet
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