LXBF-1550-FFMXX-TXX-FA
The LXBF-1550-FFMXX family is a low-noise, narrow-linewidth laser with fast frequency modulation in a standard 14pin butterfly package. It combines Smartcore's original silicon-based integrated external-cavity chip with an optimized laser-gain chip in a hybrid package, enabling fast frequency modulation over 200K~1000KHz.
Specification Snapshot
工作电流 [具体工作点见器 Items测试报告]
250 mA
工作温度
0-70 ℃
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Overview
The LXBF-1550-FFMXX family is a low-noise, narrow-linewidth laser with fast frequency modulation in a standard 14pin butterfly package. It combines Smartcore's original silicon-based integrated external-cavity chip with an optimized laser-gain chip in a hybrid package, enabling fast frequency modulation over 200K~1000KHz.
Specifications
| Parameter | Value |
|---|---|
| 输出光功率 | ≥ 10 dBm |
| 静态积分线宽 [采用延时自差拍法静态测试] | ≤ 3、5 |
| 本征线宽 | <100 Hz |
| 工作波长 | 1550±5 nm |
| 工作电流 [具体工作点见器 Items测试报告] | 250 mA |
| 相对强度噪声 | ≤-155 dBc/Hz |
| 调频速度 | 200∽1000 |
| 调频效率 [200KHz调频条 Items下测试] | 20,50 |
| 工作温度 | 0-70 ℃ |
| 光隔离度 | ≥40 dB |
Key Features
1) Ultralow phase noise and frequency noise. 2) Static integrated linewidth <3KHz. 3) Intrinsic linewidth <100Hz. 4) Fast frequency modulation of 200K~1000KHz. 5) Small built-in silicon-photonics chip with stable performance and excellent vibration characteristics. 6) Standard 14pin butterfly package. 7) Low power consumption.
Datasheet
Product Datasheet
PDF
Supplier Information
SmartCore Optoelectronics is a high-tech company dedicated to the design and application of silicon-based photonic integrated chips. Its technology stems from over a decade of research achievements by the scientific team from the Department of Electronic Engineering at Tsinghua University. The company primarily focuses on the Internet of Things (IoT) sector, with a particular emphasis on distributed optical fiber sensing and FMCW LiDAR. Recently, it has made significant progress in Co-packaged Optics (CPO) technology, aiming to develop a new generation of silicon photonics products, including silicon photonic I/O, inter-chip optical interconnects, and chiplet optical interconnects, targeting the burgeoning billion-level optical I/O market driven by the new paradigm of AI computing power. Tens of millions in Angel+ round financing; Tsinghua University contributing intellectual property as equity; silicon-based integrated ultra-narrow linewidth laser; I/O products targeting new AI computing paradigms; high-linearity light source for FMCW LiDAR.
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