LXBF-1550-FFMXX-TXX-FA

LXBF-1550-FFMXX-TXX-FA

Supplier
Smartcore
Part Number
LXBF-1550-FFMXX-TXX-FA
Category
Packages
Origin
China

The LXBF-1550-FFMXX family is a low-noise, narrow-linewidth laser with fast frequency modulation in a standard 14pin butterfly package. It combines Smartcore's original silicon-based integrated external-cavity chip with an optimized laser-gain chip in a hybrid package, enabling fast frequency modulation over 200K~1000KHz.

Specification Snapshot
工作电流 [具体工作点见器 Items测试报告]
250 mA
工作温度
0-70 ℃
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Overview

The LXBF-1550-FFMXX family is a low-noise, narrow-linewidth laser with fast frequency modulation in a standard 14pin butterfly package. It combines Smartcore's original silicon-based integrated external-cavity chip with an optimized laser-gain chip in a hybrid package, enabling fast frequency modulation over 200K~1000KHz.

Specifications

ParameterValue
输出光功率≥ 10 dBm
静态积分线宽 [采用延时自差拍法静态测试]≤ 3、5
本征线宽<100 Hz
工作波长1550±5 nm
工作电流 [具体工作点见器 Items测试报告]250 mA
相对强度噪声≤-155 dBc/Hz
调频速度200∽1000
调频效率 [200KHz调频条 Items下测试]20,50
工作温度0-70 ℃
光隔离度≥40 dB

Key Features

1) Ultralow phase noise and frequency noise. 2) Static integrated linewidth <3KHz. 3) Intrinsic linewidth <100Hz. 4) Fast frequency modulation of 200K~1000KHz. 5) Small built-in silicon-photonics chip with stable performance and excellent vibration characteristics. 6) Standard 14pin butterfly package. 7) Low power consumption.

Datasheet

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Supplier Information

Sm
Smartcore
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SmartCore Optoelectronics is a high-tech company dedicated to the design and application of silicon-based photonic integrated chips. Its technology stems from over a decade of research achievements by the scientific team from the Department of Electronic Engineering at Tsinghua University. The company primarily focuses on the Internet of Things (IoT) sector, with a particular emphasis on distributed optical fiber sensing and FMCW LiDAR. Recently, it has made significant progress in Co-packaged Optics (CPO) technology, aiming to develop a new generation of silicon photonics products, including silicon photonic I/O, inter-chip optical interconnects, and chiplet optical interconnects, targeting the burgeoning billion-level optical I/O market driven by the new paradigm of AI computing power. Tens of millions in Angel+ round financing; Tsinghua University contributing intellectual property as equity; silicon-based integrated ultra-narrow linewidth laser; I/O products targeting new AI computing paradigms; high-linearity light source for FMCW LiDAR.

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