Knight Series ps Green light 532 nm Laser Knight-Green-15
All Knight series industrial picosecond 532 lasers undergo high-temperature burn-in, thermal shock and vibration reliability testing to ensure long-term reliability under 7/24 industrial production conditions. The Knight picosecond green laser provides up to 100 W and pulse energy up to 100μJ. It offers excellent overall performance in precision machining of brittle materials, transparent-material processing, coating removal from 3C products, precision ceramic marking and cutting optoelectronic modules such as fingerprint and camera modules.
Specification Snapshot
Center Wavelength
532 nm
Average Power
15 W
Pulse Width
10~15 ps
Repetition Rate
500~2000 kHz
Operating Temperature
+10~+35 °C
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Overview
All Knight series industrial picosecond 532 lasers undergo high-temperature burn-in, thermal shock and vibration reliability testing to ensure long-term reliability under 7/24 industrial production conditions. The Knight picosecond green laser provides up to 100 W and pulse energy up to 100μJ. It offers excellent overall performance in precision machining of brittle materials, transparent-material processing, coating removal from 3C products, precision ceramic marking and cutting optoelectronic modules such as fingerprint and camera modules.
Specifications
| Parameter | Value |
|---|---|
| Center Wavelength | 532 nm |
| Average Power | 15 W |
| Pulse Width | 10~15 ps |
| Single-pulse energy [@1 MHz;@1 MHz)] | 15(@1 MHz) |
| Max Peak power [@1 MHz;@1 MHz)] | 1.5(@1 MHz) |
| Repetition Rate | 500~2000 kHz |
| Power stability [RMS] | <1 % |
| Pulse Stability [RMS] | <1 % |
| Beam quality M2 | ≤1.1 |
| Spot diameter [1/e²] | 2.0±0.3 mm |
| Spot roundness | >90 % |
| Polarization method | Horizontal |
| Polarization ratio | >100:1 |
| Optical output power adjustment range | 0~100 % |
| Frequency following function | Supported |
| Operating Voltage [50/60 Hz] | 100~240(50/60 Hz) |
| Communication Protocol | RS-232, Ethernet, USB |
| Cooling method | Water cooling Water |
| Operating Temperature | +10~+35 °C |
| Shipping dimensions [W×D×H] | 700 mm × 500 mm × 200 mm |
| Shipping weight | 70~80 kg |
| Shipping temperature | -20~+60°C |
| Shipping relative humidity | 10~80 % |
Applications
Precision processing of brittle materials; processing transparent materials; high-precision ceramic marking; etching SiP package circuits; microdrilling metals/ceramics; cutting optoelectronic modules such as fingerprint modules, camera modules and PCB/FPC; precision processing of brittle materials, processing transparent materials, high-precision ceramic marking, etching SiP package circuits, microdrilling metals/ceramics and cutting optoelectronic modules such as fingerprint modules, camera modules and PCB/FPC; precision processing of brittle and transparent materials; quartz glass; ceramics; lithium-battery tab forming.
Key Features
Integrated design; independently developed high-frequency seed source; proprietary hardware and software control system; constant power output with multistage compensation; adaptive pointing-stabilization system; real-time monitoring and recording of multiphysics data; remote diagnostics and predictive maintenance; good stability and consistency
Datasheet
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Supplier Information
Founded in 2021 by Dr. Bao Qiaoliang, a globally highly cited scientist, Klight Laser has grown into a national high-tech enterprise. The company focuses on the R&D and production of ultrafast ultraviolet and deep ultraviolet lasers (wavelengths: 355nm/266nm/213nm/193nm), providing deep ultraviolet light sources for semiconductor wafer defect detection (particle detection, bright/dark field detection) or mask inspection equipment. Klight's high-repetition-rate picosecond deep ultraviolet lasers fully match the technical specifications of international counterparts, independently developed with multiple core patented technologies and supplemented by intelligent control systems, offering customized light source matching services for domestic wafer inspection equipment integrators. Additionally, the company provides customized flexible micro-machining solutions in the form of laser modules, and has expanded into multiple application fields such as new energy, pan-semiconductor, and medical aesthetics.
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