FBG Sensing demodulation module
Based on proprietary core laser-chip technology, the FBG sensing demodulation module offers a customizable demodulation bandwidth and high-speed, multichannel synchronous photodetection. It supports custom development for bandwidths from 10nm to 60nm and demodulation rates from 1Hz to 100Hz.
Specification Snapshot
动态范围
>20 dB
工作温度 [可定制更宽]
-10~+50 ℃
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Overview
Based on proprietary core laser-chip technology, the FBG sensing demodulation module offers a customizable demodulation bandwidth and high-speed, multichannel synchronous photodetection. It supports custom development for bandwidths from 10nm to 60nm and demodulation rates from 1Hz to 100Hz.
Specifications
| Parameter | Value |
|---|---|
| 带宽 [可定制] | 1523~1568 nm |
| 波长重复性 | ±2 pm |
| 通道数 | 8/16/24/32 |
| 解调频率 | 1~100 Hz |
| 扫描步长 | 1/3/5 |
| 动态范围 | >20 dB |
| 工作温度 [可定制更宽] | -10~+50 ℃ |
| 通讯接口 | RS232 and Fast Ethernet |
| 光纤接口 [可定制] | FC/APC |
| 供电电压 | 8~30 wide-voltage input |
| 尺寸 [8通道 / 可定制] | 122*170*49 (8 Channel ) |
| 尺寸 [32通道 / 可定制] | 160*225*130(32 Channel ) |
Key Features
Customizable demodulation bandwidth; high-speed measurement up to 100Hz; stable, reliable semiconductor core light source; synchronous scanning of all channels.
Datasheet
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Supplier Information
Nanjing Huafei Photonics Technology Co., Ltd. is a technology-based innovative enterprise focusing on the R&D and production of low-cost semiconductor tunable laser chips, devices, modules, and systems. The company owns the self-invented precision photonic integrated tunable laser array technology, which won the second prize of National Technology Invention in 2018. The company is committed to the localization of large-scale precision photonic integrated tunable laser products, facilitating the large-scale deployment of wavelength-tunable scenarios such as optical communication and fiber optic sensing. The company currently has over 2,000 square meters of phase I R&D and production base with an annual output value of 100 million yuan, possessing full industrial chain capabilities from chip to module, and the phase II production line is under preparation. The company has an R&D team composed of experts in photonics, optoelectronics and semiconductor packaging, continuously promoting the innovation and development of photonic integration technology. Equipped with advanced production equipment and experimental facilities, the company ensures continuous improvement in product quality and performance, and adopts strict quality control measures to ensure that every product meets high-quality standards.
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