ALD-MCP
The ALD-MCP uses multicomponent lead-free glass as its substrate and atomic layer deposition to form the functional layers. Unlike conventional lead-containing microchannel plates, its manufacture requires no hydrogen reduction, reducing noise caused by gas adsorption in the lead-reduced layer and β decay of the ⁴⁰K isotope. The lead-free glass substrate tolerates higher baking temperatures, greatly reducing MCP outgassing and extending device life. ALD MCP bulk resistance can also be finely and independently controlled to meet special application requirements such as picosecond time-of-flight measurements.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Outer Diameter [Customizable] | Φ25mm、φ33mm、φ50mm（ Customizable ） |
| Aperture | 6μm、8μm、10μm |
| Bevel angle [Customizable] | 5°~13°（ Customizable ） |
| MCP Gain [@800 V] | ≥1×10⁴ |
| Open area ratio | ≥60 % |
| Secondary-electron emission material | Al₂O₃ or MgO |
| Bulk resistance [Customizable] | 10~300 MΩ（ Customizable ） |
| Gain Stability | ≥10 C/cm² |
| Length-to-diameter ratio | 40~60 |
Applications
Key Features
Datasheet
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