ALD-MCP
This microchannel plate uses multicomponent lead-free glass as its substrate and Atomic Layer Deposition (ALD) to form the functional layers. Unlike conventional commercial lead-containing microchannel plates, its manufacture requires no hydrogen reduction, reducing noise caused by gas adsorption in the lead-reduced layer and β decay of the K⁴⁰ isotope in conventional MCPs. The lead-free glass substrate tolerates higher baking temperatures, greatly reducing MCP outgassing and extending device life. Bulk resistance can also be finely and independently controlled to meet requirements ranging from picosecond time-of-flight measurements to other applications.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Outer Diameter | φ24.8±0.04 mm |
| Active area diameter | ＞18 mm |
| Aperture | 10 μm |
| Bevel angle | 6° |
| Current Gain [@800V；@800V)] | ≥1×10⁴(@800V) |
Applications
Key Features
Datasheet
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Supplier Information
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