Wafer Expansion Ring

The 2-inch wafer carrier for 25 wafers packages, stores, transfers or displays precision devices and stores, transfers and transports wafers and circular thin sheets. See this page's specifications for dimensions, materials and structure. Contact Kangpaike to confirm samples, specifications, materials or customization.

The acrylic vacuum-release plate for 5-inch wafers and large substrates packages, stores, transfers or displays precision devices and holds and releases wafers and large substrates. See this page's specifications for dimensions, materials and structure. Contact Kangpaike to confirm samples, specifications, materials or customization.

The 6×6-inch acrylic vacuum-release plate for wafers and large substrates packages, stores, transfers or displays precision devices and holds and releases wafers and large substrates. See this page's specifications for dimensions, materials and structure. Contact Kangpaike to confirm samples, specifications, materials or customization.

Equipment Alignment and Imprinting Capability: ≤2um

1. 8/12 compatibility: Easily exchange 8inch and 12inch substrates. 2. Modular design: Integrates EFEM, spin coater, HP, CP, NIL, Frame loading Unit, Pre-aligner and RF-reader. Additional submodules expand production capacity. 3. Precision: Minimum imprint linewidth 30nm; aspect ratio 10:1; dimensional deviation from master <3%; alignment accuracy ±2um. 4. Production: UPH 30 with excellent stability. 5. Fully automatic: Guangduo's in-house intelligent software automates all actions and provides real-time monitoring of key processes. 6. Cleanliness: Chamber environment reaches class 1; data deviation from master <3%; interwafer dimensional deviation <3%. Alignment/imprinting capability ≤2um. A precision stage provides stable alignment and eccentricity compensation.

Imprinted Line Width: 20nm

1. Imprint area: 1020mm*1520mm. 2. Imprint precision: minimum line width ≤30nm. 3. Imprint speed: ≥1m/min. 4. Roller pressure: dead weight + set rated pressure. 5. Fully automatic imprinting, exposure and demolding, with adjustable demolding angle. 6. UV source: 365nm LED, maximum rated power 500mw/cm^2; area-source size 1100mm*75mm. Exposure is completed by moving the source at constant speed. 7. The chamber includes an FFU and an antistatic device to maintain a good internal environment. 8. Graphical software interface with real-time production-data feedback.