Chip Cutting and Stripping Equipment
This semiautomatic equipment first uses a laser to cut the front of individual chips on a bonded wafer, then flips the wafer for laser debonding through the glass.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Equipment Capabilities | Chip cutting + chip debonding; Map import selects chips for processing |
| Laser Type | UV（Ps） |
| Processing material | EMC、Si、Pi etc. |
| Wafer Size | 12" |
| Processing capability | Cuts completely through chip material with precise control of damage to the glass carrier. |
| Wafer Thickness | ≥1000μm |
| Processing accuracy | ≤±50μm |
| Additional Functions | Heating, plasma Cleaning |
Key Features
Datasheet
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Supplier Information
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