Substrate Module Cutting and Sorting Equipment
This fully automatic equipment uses an ultraviolet nanosecond laser to cut and sort substrates after SMT assembly. Substrates are loaded from a Slot Magazine, inspected after cutting and sorted into JEDEC Trays.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Equipment Type | Fully Automatic Laser Cutting and Sorting Equipment |
| Loading/Unloading Method-Loading | Slot Magazine |
| Loading/Unloading Method-Unloading | JEDEC Tray |
| Main Unit Transport Method | Linear-Motor Stage |
| Marking Accuracy | ±50μm |
| Positioning method | CCD |
| Compatible with Product dimensions -L | 150-300 |
| Compatible with Product dimensions -W | 50-100 |
| Bend Resistance-Long Side | 3mm |
| Bend Resistance-Short Side | 2mm |
| Focus Adjustment Method | Mechanical Z-Axis |
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