Printing-Screen Laser Etching Equipment ASP-6483-D

Printing-Screen Laser Etching Equipment ASP-6483-D

Supplier
Delphilaser
Part Number
ASP-6483-D
Category
Semiconductor Manufacturing Equipment
Origin
China

This equipment etches line patterns on solar and nonsolar screen-printing screens, with a PT value of <10μm and line-width uniformity of less than 1μm. It can be upgraded to combine wire drawing and etching.

Specification Snapshot
Positioning accuracy
±1μm
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Overview

This equipment etches line patterns on solar and nonsolar screen-printing screens, with a PT value of <10μm and line-width uniformity of less than 1μm. It can be upgraded to combine wire drawing and etching.

Specifications

ParameterValue
FunctionIntegrated PI etching and wire extraction
Applicable Products356&450
Positioning accuracy±1μm
Repeatability±0.75μm
Equipment Dimensions1670 mm × 2010 mm × 1910 mm

Applications

Etching line patterns on solar and non-solar screen-printing meshes.

Key Features

Uses an in-house-developed UV picosecond laser; scribing taper is 6±1μm and decreases with adhesive quantity, reaching 4μm at an adhesive thickness of 5μm; layered energy-control processing leaves no scratches on the wire surface and provides excellent ink passage.

Datasheet

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Supplier Information

De
Delphilaser
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Suzhou Delphi Laser Co., Ltd., established in 2005 and located in Suzhou Industrial Park, is mainly engaged in the R&D, production and sales of high-end industrial precision laser processing equipment and its core device laser. The company is a technology-driven enterprise, always dedicated to the cutting-edge research and development of new products, technologies and processes. Focusing on the field of laser precision micro-machining, with advanced laser technology, high-precision motion control technology and profound expertise in laser micro-machining processes, it concentrates on application areas such as semiconductors, electronics, photovoltaics, lithium batteries and flat panel displays, providing laser processing solutions for various ultra-thin, ultra-hard, brittle, flexible and composite materials. Through independent research and development, the company has mastered core technologies and industrialized mature products of nanosecond, ultrafast (picosecond, femtosecond) and adjustable pulse width solid-state lasers. The company targets high-tech and frontier applications, conducting cutting-edge R&D on various laser-applied materials and processes, promptly launching precision laser processing solutions, continuously expanding the application fields of laser micro-machining, and assisting the transformation and upgrading of China's manufacturing industry. Currently, the company's products are widely used in the scribing of third-generation semiconductor wafers such as SiC and GaN, MEMS chip cutting, and cutting and processing for Mini LED and 5G antennas. Since its establishment, Delphi Laser has adhered to the corporate spirit of 'integrity, dedication, teamwork, innovation', shouldered the mission of 'exploring the micro-nano world with lasers', strengthened core technology development and market competitiveness, and is committed to becoming a globally influential laser company in the field of precision micro-machining.

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Printing-Screen Laser Etching Equipment ASP-6483-D
Delphilaser · Semiconductor Manufacturing Equipment
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