Diamond Polishing Pad Y20
Sciyea diamond grinding pads require no slurry mixing, save grinding and polishing time, improve the workshop environment and greatly reduce slurry-handling costs. Adhesive backing allows easy attachment to and removal from grinding plates. The pads fit existing grinding or polishing plates directly.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Thickness | 2.20 mm |
| Particle size | 20 μm |
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